Through Hole Lamp
LTL42TG6NJLCH252
9. Reliability Test
Classification
Test Item
Test Condition
Sample Size
Reference Standard
Ta = Under room temperature
IF = per datasheet maximum drive
current
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-750D:1026 (1995)
MIL-STD-883G:1005 (2006)
Operation Life
Test Time= 1000hrs
High Temperature
High Humidity
storage
Ta = 60°C
RH = 90%
Test Time= 240hrs
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-202G:103B (2002)
JEITA ED-4701:100 103 (2001)
Endurance
Test
MIL-STD-750D:1031 (1995)
MIL-STD-883G:1008 (2006)
JEITA ED-4701:200 201 (2001)
22 PCS
(CL=90%;
LTPD=10%)
High Temperature
Storage
Ta= 105 ± 5°C
Test Time= 1000hrs
22 PCS
(CL=90%;
LTPD=10%)
Low Temperature
Storage
Ta= -55 ± 5°C
Test Time= 1000hrs
JEITA ED-4701:200 202 (2001)
MIL-STD-750D:1051 (1995)
MIL-STD-883G:1010 (2006)
JEITA ED-4701:100 105 (2001)
JESD22-A104C (2005)
100°C ~ 25°C ~ -40°C ~ 25°C
22 PCS
(CL=90%;
LTPD=10%)
Temperature
Cycling
30mins
5mins
30mins 5mins
30 Cycles
100 ± 5°C ~ -30°C ± 5°C
MIL-STD-750D:1056 (1995)
MIL-STD-883G:1011 (2006)
MIL-STD-202G:107G (2002)
JESD22-A106B (2004)
22 PCS
(CL=90%;
LTPD=10%)
Thermal
Shock
15mins
15mins
30 Cycles
(<20 secs transfer)
Environmental
Test
T.sol = 260 ± 5°C
Dwell Time= 10±1 seconds
3mm from the base of the epoxy bulb
11 PCS
(CL=90%;
LTPD=18.9%)
Solder
Resistance
MIL-STD-750D:2031(1995)
JEITA ED-4701: 300 302 (2001)
T. sol = 245 ± 5°C
MIL-STD-750D:2026 (1995)
MIL-STD-883G:2003 (2006)
MIL-STD-202G:208H (2002)
IPC/EIA J-STD-002 (2004)
11 PCS
(CL=90%;
LTPD=18.9%)
Dwell Time= 5 ± 0.5 seconds
(Lead Free Solder, Coverage ≧95% of
the dipped surface)
Solderability
11 PCS
(CL=90%;
LTPD=18.9%)
T. sol = 350 ± 5°C
Dwell Time= 3.5 ± 0.5 seconds
MIL-STD-202G:208H (2002)
JEITA ED-4701:300 302 (2001)
Soldering Iron
10. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
Part No. : LTL42TG6NJLCH252
BNS-OD-FC002/A4
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