Datasheet > LQFP

LQFP

更新时间： 2024-11-12 03:52:15

品牌	Logo	应用领域
AMKOR		/
页数	文件大小	规格书
2页	657K
描述
Low Profile Quad Flat Pack (LQFP) Packages

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中文翻译

获取价格

数据手册

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LQFP 数据手册

LEADFRAME

data sheet

LQFP

Features:

Amkor’s LQFP packaging portfolio provides:

• 7 x 7 mm to 28 x 28 mm body size • 32 to 256 lead counts

• Copper leadframes

• Broad selection of die pad sizes

• Custom leadframe design available

• Low stress die attach adhesive

• Power enhancement version - PowerQuad

• 1.4 mm body thickness

• Rapid cure mold compound



Thermal Resistance:

Single-Layer PCB

Theta JA (°C/W) by Velocity (LFPM)

Low Profile Quad Flat

Pack (LQFP) Packages:

Pkg

Body Size (mm) Pad Size (mm)

200

500

32 ld

100 ld

144 ld

176 ld

7 x 7

5 x 5

8 x 8

67.8

41.5

39.7

38.0

38.3

55.9

33.4

31.8

31.2

31.9

50.1

29.5

28.3

28.1

29.0

Amkor offers a broad line of LQFP IC packages

designed to provide the same great benefits

as MQFP packaging with a 1.4 mm body

thickness. This allows IC packaging engineers,

component specifiers and systems designers

to solve issues such as increasing board

density, die shrink programs, thin end-product

profile and portability.

14 x 14

14 x 20

20 x 20

24 x 24

9.5 x 9.5

8.5 x 8.5

8 x 8

JEDEC Standard Test Boards

Multi-Layer PCB

Theta JA (°C/W) by Velocity (LFPM)

Pkg

Body Size (mm) Pad Size (mm)

200

500

32 ld

100 ld

144 ld

176 ld

208 ld*

7 x 7

5 x 5

8 x 8

47.9

31.7

30.0

31.7

31.9

18.1

42.1

26.8

25.1

26.9

27.3

15.3

39.4

24.7

23.0

24.9

25.4

14.4

14 x 14

14 x 20

20 x 20

24 x 24

28 x 28

9.5 x 9.5

8.5 x 8.5

8 x 8

Applications:

Amkor’s LQFPs are an ideal IC package for

most IC semiconductor technologies such as

ASIC, DSP, controllers, processors, gate arrays

(FPGA/PLD), SRAMs and PC chip sets.

16 x 16

*Pre-JEDEC Standard Test Boards

Tested

1 W

All others - JEDEC Standard Test Boards

LQFPs are particularly suited for light weight,

portable electronics requiring broad perform-

ance characteristics. Such applications are lap-

top PCs, video/audio, telecom, cordless/RF,

data acquisition, office equipment, disc-drives

and communication boards.

Electrical:

Body Size PadSize

Pkg

32 ld

(mm)

Lead

(nH)

0.904

(pF)

^{Inductance Capacitance Res}(^ism^taΩ^nce)

7 x 7 5 x 5 Longest

0.211

0.202

0.225

0.200

0.419

0.322

1.100

1.070

1.270

1.340

1.380

1.210

9.2

7.8

Shortest 0.799

48 ld

7 x 7 5 x 5 Longest

1.110

13.8

12.0

26.3

17.8

62.9

52.6

89.0

64.0

86.2

64.8

Shortest 0.962

100 ld 14 x 14 8 x 8 Longest

2.300

Shortest 1.520

144 ld 20 x 20 8.5 x 8.5 Longest

6.430

Shortest 4.230

176 ld 24 x 24 8 x 8 Longest

9.510

Shortest 5.200

208 ld 28 x 28 11 x 11 Longest

9.670

Shortest 6.190

Simulated Results

@ 100 MHz

Reliability:

IC chips are assembled in optimized package designs with proven reliable

semiconductor materials.

• Moisture sensitivity

characterization

• PCT

JEDEC Level 3

30 °C/60%RH, 192 hrs

121 °C, 100%RH, 2 atm, 504 hours

-55/+125 ° C, 1000 cycles

85 °C/85% RH, 1000 hours

150 °C, 1000 hours

• Temp cycle

• Temp/humidity

• High temp storage

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

^{TO VIEW THE MOST CURRENT PRODUCT INFORMATION}.

DS232B

Rev Date: 08’00

www.amkor.com

中文翻译

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与LQFP相关器件

型号	品牌	获取价格	描述	数据表
LQFP080-P-1414A	PANASONIC	获取价格	Buzzer output, remote control carrier signal output, high-current drive port
LQFP100	STMICROELECTRONICS	获取价格	8/16-BIT SINGLE VOLTAGE FLASH MCU FAMILY WITH RAM, E3 TM(EMULATED EEPROM), CAN 2.0B AND J1
LQFP100	NXP	获取价格	Single-chip 16-bit/32-bit ocontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0
LQFP100-P-1414-0.50F	TOSHIBA	获取价格	LQFP100
LQFP100-P-1414-0.50G	TOSHIBA	获取价格	LQFP100
LQFP100-P-1414-0.50H	TOSHIBA	获取价格	LQFP100
LQFP144	STMICROELECTRONICS	获取价格	High-density value line, advanced ARM-based 32-bit MCU with 256 to 512 KB Flash, 16 timers
LQFP144	NXP	获取价格	32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced co
LQFP144-P-1616-0.40C	TOSHIBA	获取价格	LQFP144
LQFP144-P-2020-0.50D	TOSHIBA	获取价格	LQFP144

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