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LPC2926FBD144,551 PDF预览

LPC2926FBD144,551

更新时间: 2024-10-27 20:41:19
品牌 Logo 应用领域
恩智浦 - NXP 时钟PC微控制器外围集成电路
页数 文件大小 规格书
95页 574K
描述
LPC2926/2927/2929 - ARM9 microcontroller with CAN, LIN, and USB QFP 144-Pin

LPC2926FBD144,551 技术参数

Source Url Status Check Date:2013-10-15 00:00:00是否Rohs认证: 符合
生命周期:Not Recommended零件包装代码:QFP
包装说明:20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT486-1, LQFP-144针数:144
Reach Compliance Code:compliant风险等级:5.76
具有ADC:YES地址总线宽度:24
位大小:32CPU系列:ARM9
最大时钟频率:40 MHzDAC 通道:NO
DMA 通道:YES外部数据总线宽度:32
JESD-30 代码:S-PQFP-G144JESD-609代码:e3
长度:20 mm湿度敏感等级:2
I/O 线路数量:104端子数量:144
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LFQFP封装等效代码:QFP144,.87SQ,20
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:1.8,3.3,3.3/5 V
认证状态:Not QualifiedRAM(字节):57344
ROM(单词):262144ROM可编程性:FLASH
座面最大高度:1.6 mm速度:125 MHz
子类别:Microcontrollers最大供电电压:1.89 V
最小供电电压:1.71 V标称供电电压:1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin (Sn)
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:20 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

LPC2926FBD144,551 数据手册

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LPC2926/2927/2929  
ARM9 microcontroller with CAN, LIN, and USB  
Rev. 5 — 28 September 2010  
Product data sheet  
1. General description  
The LPC2926/2927/2929 combine an ARM968E-S CPU core with two integrated TCM  
blocks operating at frequencies of up to 125 MHz, Full-speed USB 2.0 OTG and device  
controller, CAN and LIN, 56 kB SRAM, up to 768 kB flash memory, external memory  
interface, three 10-bit ADCs, and multiple serial and parallel interfaces in a single chip  
targeted at consumer, industrial and communication markets. To optimize system power  
consumption, the LPC2926/2927/2929 has a very flexible Clock Generation Unit (CGU)  
that provides dynamic clock gating and scaling.  
2. Features and benefits  
„ ARM968E-S processor running at frequencies of up to 125 MHz maximum.  
„ Multi-layer AHB system bus at 125 MHz with four separate layers.  
„ On-chip memory:  
‹ Two Tightly Coupled Memories (TCM), 32 kB Instruction TCM (ITCM), 32 kB Data  
TCM (DTCM).  
‹ Two separate internal Static RAM (SRAM) instances; 32 kB SRAM and 16 kB  
SRAM.  
‹ 8 kB ETB SRAM also available for code execution and data.  
‹ Up to 768 kB high-speed flash-program memory.  
‹ 16 kB true EEPROM, byte-erasable and programmable.  
„ Dual-master, eight-channel GPDMA controller on the AHB multi-layer matrix which can  
be used with the Serial Peripheral Interface (SPI) interfaces and the UARTs, as well as  
for memory-to-memory transfers including the TCM memories.  
„ External Static Memory Controller (SMC) with eight memory banks; up to 32-bit data  
bus; up to 24-bit address bus.  
„ Serial interfaces:  
‹ USB 2.0 full-speed device/OTG controller with dedicated DMA controller and  
on-chip device PHY.  
‹ Two-channel CAN controller supporting FullCAN and extensive message filtering.  
‹ Two LIN master controllers with full hardware support for LIN communication. The  
LIN interface can be configured as UART to provide two additional UART  
interfaces.  
‹ Two 550 UARTs with 16-byte Tx and Rx FIFO depths, DMA support, and  
RS485/EIA-485 (9-bit) support.  
‹ Three full-duplex Q-SPIs with four slave-select lines; 16 bits wide; 8 locations deep;  
Tx FIFO and Rx FIFO.  
‹ Two I2C-bus interfaces.  
 
 

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