是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | BGA |
包装说明: | TFBGA, | 针数: | 180 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.32 | Is Samacsys: | N |
具有ADC: | YES | 其他特性: | ALSO REQUIRES 1.8V OR 3.3V SUPPLY |
地址总线宽度: | 位大小: | 32 | |
最大时钟频率: | 25 MHz | DAC 通道: | NO |
DMA 通道: | YES | 外部数据总线宽度: | |
JESD-30 代码: | S-PBGA-B180 | JESD-609代码: | e1 |
长度: | 12 mm | 湿度敏感等级: | 3 |
I/O 线路数量: | 端子数量: | 180 | |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | ROM可编程性: | FLASH |
座面最大高度: | 1.2 mm | 速度: | 180 MHz |
最大供电电压: | 1.3 V | 最小供电电压: | 1 V |
标称供电电压: | 1.2 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 12 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
LPC3131FET180,551 | NXP | LPC3130/3131 - Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, a |
获取价格 |
|
LPC3141 | NXP | NXP Microcontrollers Selection Guide |
获取价格 |
|
LPC3141FET180 | NXP | ARM926EJ-S with 192 kB SRAM, USB High-speed OTG, SD/MMC, NAND flash controller |
获取价格 |
|
LPC3141FET180,551 | NXP | LPC3141FET180 - ARM926EJ-S with 192 kB SRAM, USB High-speed OTG, SD/MMC, NAND flash contro |
获取价格 |
|
LPC3143 | NXP | NXP Microcontrollers Selection Guide |
获取价格 |
|
LPC3143FET180 | NXP | ARM926EJ-S with 192 kB SRAM, USB High-speed OTG, SD/MMC, NAND flash controller, Decryption |
获取价格 |