Source Url Status Check Date: | 2013-06-14 00:00:00 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | BGA |
包装说明: | TFBGA, BGA144,13X13,32 | 针数: | 144 |
Reach Compliance Code: | compliant | 风险等级: | 5.74 |
具有ADC: | YES | 其他特性: | ALSO REQUIRES 3.3 V SUPPLY |
地址总线宽度: | 24 | 位大小: | 32 |
CPU系列: | ARM7 | 最大时钟频率: | 50 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | 32 | JESD-30 代码: | S-PBGA-B144 |
JESD-609代码: | e1 | 长度: | 12 mm |
湿度敏感等级: | 2 | I/O 线路数量: | 76 |
端子数量: | 144 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装等效代码: | BGA144,13X13,32 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 1.8,3.3 V | 认证状态: | Not Qualified |
RAM(字节): | 65536 | ROM(单词): | 0 |
座面最大高度: | 1.2 mm | 速度: | 60 MHz |
子类别: | Microcontrollers | 最大压摆率: | 70 mA |
最大供电电压: | 1.95 V | 最小供电电压: | 1.65 V |
标称供电电压: | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 12 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
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