是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | TFBGA, BGA144,13X13,32 | 针数: | 144 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.24 |
Is Samacsys: | N | 具有ADC: | YES |
其他特性: | ALSO REQUIRES 3.3V SUPPLY | 地址总线宽度: | 24 |
位大小: | 32 | CPU系列: | ARM7 |
最大时钟频率: | 50 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | 32 |
JESD-30 代码: | S-PBGA-B144 | JESD-609代码: | e1 |
长度: | 12 mm | 湿度敏感等级: | 2 |
I/O 线路数量: | 112 | 端子数量: | 144 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装等效代码: | BGA144,13X13,32 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 1.8,3.3 V |
认证状态: | Not Qualified | RAM(字节): | 16384 |
ROM(单词): | 262144 | ROM可编程性: | FLASH |
座面最大高度: | 1.2 mm | 速度: | 60 MHz |
子类别: | Microcontrollers | 最大供电电压: | 1.95 V |
最小供电电压: | 1.65 V | 标称供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 12 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
LPC2292FET144/00 | NXP |
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