生命周期: | Active | 零件包装代码: | QFN |
包装说明: | 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33 | 针数: | 33 |
Reach Compliance Code: | unknown | HTS代码: | 8542.31.00.01 |
风险等级: | 5.7 | 具有ADC: | YES |
地址总线宽度: | 位大小: | 32 | |
最大时钟频率: | 25 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | S-PQCC-N33 | 长度: | 7 mm |
I/O 线路数量: | 28 | 端子数量: | 33 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | NO | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | ROM可编程性: | FLASH |
座面最大高度: | 1 mm | 速度: | 50 MHz |
最大供电电压: | 3.6 V | 最小供电电压: | 1.8 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | NO LEAD | 端子节距: | 0.65 mm |
端子位置: | QUAD | 宽度: | 7 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
LPC1113FHN33/203,5 | NXP |
获取价格 |
LPC1113FHN33 - 24kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin | |
LPC1113FHN33/301 | NXP |
获取价格 |
Cortex-M0 based microcontrollers with industry-leading power and efficiency | |
LPC1113FHN33/302,5 | NXP |
获取价格 |
LPC1113FHN33 - 24kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin | |
LPC1113FHN33/303,5 | NXP |
获取价格 |
LPC1113FHN33 - 24kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin | |
LPC1113JBD48 | NXP |
获取价格 |
Scalable Entry Level 32-bit Microcontroller (MCU) based on ARM Cortex-M0+/M0 Cores | |
LPC1113JBD48/303 | NXP |
获取价格 |
RISC MICROCONTROLLER | |
LPC1113JBD48/303,151 | NXP |
获取价格 |
RISC Microcontroller, 32-Bit, FLASH, CMOS, PQFP48 | |
LPC1113JBD48/303QL | NXP |
获取价格 |
LPC1113JBD48 - 24kB flash, 8kB SRAM, LQFP48 package QFP 48-Pin | |
LPC1113JHN33 | NXP |
获取价格 |
Scalable Entry Level 32-bit Microcontroller (MCU) based on ARM Cortex-M0+/M0 Cores | |
LPC1113JHN33/203,551 | NXP |
获取价格 |
RISC Microcontroller, 32-Bit, FLASH, CMOS, PQCC33 |