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LMV1015UR-15/NOPB PDF预览

LMV1015UR-15/NOPB

更新时间: 2024-11-18 14:52:43
品牌 Logo 应用领域
德州仪器 - TI 放大器商用集成电路
页数 文件大小 规格书
14页 838K
描述
AUDIO PREAMPLIFIER

LMV1015UR-15/NOPB 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:FBGA, BGA4,2X2,20Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.33.00.01
Factory Lead Time:1 week风险等级:5.39
商用集成电路类型:AUDIO PREAMPLIFIERJESD-30 代码:S-PBGA-B4
JESD-609代码:e1湿度敏感等级:1
功能数量:1端子数量:4
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA4,2X2,20封装形状:SQUARE
封装形式:GRID ARRAY, FINE PITCH峰值回流温度(摄氏度):260
电源:2.2/5 V认证状态:Not Qualified
子类别:Audio/Video Amplifiers最大压摆率:0.325 mA
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.5 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

LMV1015UR-15/NOPB 数据手册

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LMV1015  
www.ti.com  
SNAS291B MARCH 2005REVISED APRIL 2013  
LMV1015 Analog Series: Built-in Gain IC's for High Sensitivity 2-Wire Microphones  
Check for Samples: LMV1015  
1
FEATURES  
DESCRIPTION  
The LMV1015 is an audio amplifier series for small  
form factor electret microphones. This 2-wire portfolio  
is designed to replace the JFET amplifier. The  
LMV1015 series is ideally suited for applications  
requiring high signal integrity in the presence of  
ambient or RF noise, such as in cellular  
communications. The LMV1015 audio amplifiers are  
ensured to operate over a 2.2V to 5.0V supply  
voltage range with fixed gains of 15.6 dB and 23.8  
dB. The devices offer excellent THD, gain accuracy  
and temperature stability as compared to a JFET  
microphone.  
2
(Typical LMV1015-15, 2.2V supply, RL = 2.2 k,  
C = 2.2 μF, VIN = 18 mVPP, unless otherwise  
specified)  
Supply Voltage: 2V - 5V  
Supply Current: <180 μA  
Signal to Noise Ratio (A-Weighted): 60 dB  
Output Voltage Noise (A-Weighted): 89 dBV  
Total Harmonic Distortion 0.09%  
Voltage Gain  
LMV1015-15: 15.6 dB  
LMV1015-25: 23.8 dB  
The LMV1015 series enables a two-pin electret  
microphone solution, which provides direct pin-to-pin  
compatibility with the existing older JFET market.  
Temperature Range: 40°C to 85°C  
Large Dome 4-Bump DSBGA Package with  
Improved Adhesion Technology.  
Texas Instruments' built-in gain families are offered in  
extremely thin space saving 4-bump DSBGA  
packages (0.3 mm maximum). The LMV1015XR is  
designed for 1.0 mm ECM canisters and thicker.  
These extremely miniature packages have the Large  
Dome Bump (LDB) technology. This DSBGA  
technology is designed for microphone PCBs  
requiring 1 kg adhesion criteria.  
APPLICATIONS  
Cellular Phones  
Headsets  
Mobile Communications  
Automotive Accessories  
PDAs  
Accessory Microphone Products  
Schematic Diagram  
Built-In Gain Electret Microphone  
DIAPHRAGM  
V
DD  
2.2k  
AIRGAP  
ELECTRET  
2.2mF  
BACKPLATE  
CONNECTOR  
OUTPUT  
LMV1015  
IC  
-
INPUT  
+
-
+
GND  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2005–2013, Texas Instruments Incorporated  

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