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LM285M-1.2X PDF预览

LM285M-1.2X

更新时间: 2024-09-14 13:01:23
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LM285M-1.2X 数据手册

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LM185-1.2-N, LM285-1.2-N, LM385-1.2-N  
www.ti.com  
SNVS742E JANUARY 2000REVISED APRIL 2013  
LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode  
Check for Samples: LM185-1.2-N, LM285-1.2-N, LM385-1.2-N  
Careful design of the LM185-1.2-N has made the  
1
FEATURES  
device exceptionally tolerant of capacitive loading,  
making it easy to use in almost any reference  
application. The wide dynamic operating range allows  
its use with widely varying supplies with excellent  
regulation.  
2
±1% and 2% Initial Tolerance  
Operating Current of 10μA to 20mA  
1Ω Dynamic Impedance  
Low Temperature Coefficient  
Low Voltage Reference—1.235V  
The extremely low power drain of the LM185-1.2-N  
makes it useful for micropower circuitry. This voltage  
reference can be used to make portable meters,  
regulators or general purpose analog circuitry with  
battery life approaching shelf life.  
2.5V Device and Adjustable Device Also  
Available  
LM185-2.5 Series and LM185 Series,  
respectively  
Further, the wide operating current allows it to  
replace older references with a tighter tolerance part.  
DESCRIPTION  
The LM185-1.2-N is rated for operation over a 55°C  
to 125°C temperature range while the LM285-1.2-N is  
rated 40°C to 85°C and the LM385-1.2-N 0°C to  
70°C. The LM185-1.2-N/LM285-1.2-N are available in  
a hermetic TO package and the LM285-1.2-N/LM385-  
1.2-N are also available in a low-cost TO-92 molded  
package, as well as SOIC and SOT-23.  
The LM185-1.2-N/LM285-1.2-N/LM385-1.2-N are  
micropower 2-terminal band-gap voltage regulator  
diodes. Operating over a 10μA to 20mA current  
range, they feature exceptionally low dynamic  
impedance and good temperature stability. On-chip  
trimming is used to provide tight voltage tolerance.  
Since the LM185-1.2-N band-gap reference uses only  
transistors and resistors, low noise and good long  
term stability result.  
CONNECTION DIAGRAM  
Figure 1. T0-92 Package (LP)  
(Bottom View)  
Figure 3. SOIC Package  
* Pin 3 is attached to the Die Attach Pad  
(DAP) and should be connected to Pin 2 or  
left floating.  
Figure 2. SOT-23  
Figure 4. TO Package (NDV)  
(Bottom View)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2000–2013, Texas Instruments Incorporated  

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