是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | DIP | 包装说明: | DIP, |
针数: | 24 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.41 |
风险等级: | 5.92 | Is Samacsys: | N |
最长访问时间: | 50 ns | 其他特性: | AUTOMATIC POWER-DOWN; RADIATION-HARD SRAM |
JESD-30 代码: | R-CDIP-T24 | 长度: | 30.48 mm |
内存密度: | 65536 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 1 | 湿度敏感等级: | 3 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 24 | 字数: | 65536 words |
字数代码: | 64000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 80 °C | 最低工作温度: | |
组织: | 64KX1 | 输出特性: | 3-STATE |
可输出: | NO | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | DIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 并行/串行: | PARALLEL |
认证状态: | Not Qualified | 座面最大高度: | 4.953 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | COMMERCIAL EXTENDED |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 宽度: | 15.24 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
L7CX187HMB50 | LOGIC |
获取价格 |
Standard SRAM, 64KX1, 60ns, CMOS, CDIP24, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-24 | |
L7CX187HME50 | LOGIC |
获取价格 |
Standard SRAM, 64KX1, 60ns, CMOS, CDIP24, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-24 | |
L7CX197HC50 | LOGIC |
获取价格 |
Standard SRAM, 256KX1, 50ns, CMOS, CDIP24, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-2 | |
L7CX197HMB50 | LOGIC |
获取价格 |
Standard SRAM, 256KX1, 60ns, CMOS, CDIP24, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-2 | |
L7CX197HME50 | LOGIC |
获取价格 |
Standard SRAM, 256KX1, 60ns, CMOS, CDIP24, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-2 | |
L7H RID1.9x2x3.4H0.9(Balun) | TDK |
获取价格 |
Balun Cores(RID/Double-Aperture) | |
L7H RID1.9x2x3.4H0.9(EMC) | TDK |
获取价格 |
EMC Suppression(RID/Double-Aperture) | |
L7H RID2.6x4x5.1H1.4(Balun) | TDK |
获取价格 |
Balun Cores(RID/Double-Aperture) | |
L7H RID2.6x4x5.1H1.4(EMC) | TDK |
获取价格 |
EMC Suppression(RID/Double-Aperture) | |
L7H RID3x2x5H1.2(Balun) | TDK |
获取价格 |
Balun Cores(RID/Double-Aperture) |