是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | DIP | 包装说明: | DIP, |
针数: | 24 | Reach Compliance Code: | unknown |
ECCN代码: | 3A001.A.2.C | HTS代码: | 8542.32.00.41 |
风险等级: | 5.92 | 最长访问时间: | 60 ns |
其他特性: | AUTOMATIC POWER-DOWN; RADIATION-HARD SRAM | JESD-30 代码: | R-CDIP-T24 |
长度: | 30.48 mm | 内存密度: | 262144 bit |
内存集成电路类型: | STANDARD SRAM | 内存宽度: | 1 |
湿度敏感等级: | 3 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 24 |
字数: | 262144 words | 字数代码: | 256000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 256KX1 |
输出特性: | 3-STATE | 可输出: | NO |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | DIP |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
并行/串行: | PARALLEL | 认证状态: | Not Qualified |
座面最大高度: | 4.953 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
宽度: | 15.24 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
L7H RID1.9x2x3.4H0.9(Balun) | TDK |
获取价格 |
Balun Cores(RID/Double-Aperture) | |
L7H RID1.9x2x3.4H0.9(EMC) | TDK |
获取价格 |
EMC Suppression(RID/Double-Aperture) | |
L7H RID2.6x4x5.1H1.4(Balun) | TDK |
获取价格 |
Balun Cores(RID/Double-Aperture) | |
L7H RID2.6x4x5.1H1.4(EMC) | TDK |
获取价格 |
EMC Suppression(RID/Double-Aperture) | |
L7H RID3x2x5H1.2(Balun) | TDK |
获取价格 |
Balun Cores(RID/Double-Aperture) | |
L7H RID3x2x5H1.2(EMC) | TDK |
获取价格 |
EMC Suppression(RID/Double-Aperture) | |
L7H RID3x3x5H1.2(Balun) | TDK |
获取价格 |
Balun Cores(RID/Double-Aperture) | |
L7H RID3x3x5H1.2(EMC) | TDK |
获取价格 |
EMC Suppression(RID/Double-Aperture) | |
L7H RID3x5x5H1.2(Balun) | TDK |
获取价格 |
Balun Cores(RID/Double-Aperture) | |
L7H RID3x5x5H1.2(EMC) | TDK |
获取价格 |
EMC Suppression(RID/Double-Aperture) |