L7C108
PRELIMINARY INFORMATION L7C109
128K x 8 Static RAM
Pin Configuration
FEATURES
128K x 8 Static RAM with Chip
32-pin Ceramic DIP
32-pin Ceramic SOJ
Select Powerdown, Output Enable
and Single or Dual Chip Selects
32-pin Quad CLCC
32-pin Ceramic LCC
High Speed — to 15 ns maximum
Operational Power, -L Version
Active: 140 mA at 15 ns
Standby: 1 mA max
1
2
3
4
5
6
7
8
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
NC
V
A
CE
CC
15
1
2
3
4
5
6
7
8
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
NC
V
A
CE
WE
CC
15
A
A
A
16
14
12
A16
A14
A12
4
3
2
1
32 31 30
29
2
2
WE
5
6
7
8
9
A7
A6
A5
A4
A3
WE
A13
A8
A
A
A
A
A
A
A
A
7
6
5
4
3
2
1
0
1
2
3
A
A
A
A
OE
A10
CE
DQ
DQ
DQ
DQ
DQ
13
8
A
A
A
A
A
A
A
A
7
6
5
4
3
2
1
0
1
2
3
A
A
A
A
13
Data Retention at 2 V for Battery
Backup Operation
28
27
26
25
24
23
22
21
8
9
9
A9
11
Top
View
11
Screened to MIL-STD-883, Class B
or to SMD 5962-89598
A11
OE
A10
CE1
DQ8
9
9
OE
A10
A2 10
A1 11
A0 12
10
11
12
13
14
15
16
10
11
12
13
14
15
16
Package Styles Available:
CE
DQ
DQ
DQ
DQ
DQ
8
7
6
5
4
8
7
6
5
4
ꢀ 32-pin Ceramic 400mil DIPꢁꢂD12ꢃ
ꢀ 32-pin Ceramic LCCꢁꢂK11ꢃ
ꢀ 32-pin Ceramic SOꢄꢁꢂꢅ1ꢃ
DQ1 13
DQ
DQ
DQ
DQ
DQ
DQ
14 15 16 17 18 19 20
VSS
VSS
ꢀ 32-pin ꢆuad Ceramic LCCꢁꢂKA1ꢃ
OVERVIEW
The L7C108 and L7C109 are high-perfor-
mance, low-power CMOS static RAMs.
The storage circuitry is organized as
131,072 words by 8 bits per word. The
8 Data In and Data Out signals share I/O
pins. The L7C108 has a single active-
low Chip Enable. The L7C109 has two
Chip Enables ꢁone active-lowꢃ. These
devices are available in three speeds
with maximum access times from 15 ns
to 45 ns.
Chip Enables and a three-state I/O bus
with a separate Output Enable control
simplify the connection of several chips
for increased storage capacity.
may be used to terminate the write oper-
ation. Data In and Data Out signals have
the same polarity.
Latchup and static discharge protection
are provided on-chip. The L7C108 and
L7C109 can withstand an injection cur-
rent of up to 200 mA on any pin without
damage.
Memory locations are specified on
address pins A0 through A16. For the
L7C108, reading from a designated
location is accomplished by present-
ing an address and driving CE1 and OE
LOW while WE remains HIGH. For the
L7C109, CE1 and OE must be LOW
while CE2 and WE are HIGH.The data in
the addressed memory location will then
appear on the Data Out pins within one
access time. The output pins stay in a
high-impedance state when CE1 or OE is
HIGH, or CE2 ꢁL7C109ꢃ or WE is LOW.
Writing to an addressed location is
accomplished when the active-low CE1
and WE inputs are both LOW, and CE2
ꢁL7C109ꢃ is HIGH. Any of these signals
Inputs and outputs are TTL compatible.
Operation is from a single +5 V power
supply. Power consumption is 140 mA
ꢁ-L Versionꢃ at 15 ns. Data may be
retained in inactive storage with a supply
voltage as low as 2 V.
The L7C108 and L7C109 provide asyn-
chronous ꢁunclockedꢃ operation with
matching access and cycle times. The
1M Static RAMs
LOGIC Devices Incorporated
www.logicdevices.com
1
Aug 11, 2010 LDS-L7C108/9-F