KF10N50PR/FR
SEMICONDUCTOR
N CHANNEL MOS FIELD
EFFECT TRANSISTOR
TECHNICAL DATA
General Description
KF10N50PR
A
This planar stripe MOSFET has better characteristics, such as fast
switching time, fast reverse recovery time, low on resistance, low gate
charge and excellent avalanche characteristics. It is mainly suitable for
active power factor correction and switching mode power supplies.
O
C
F
E
I
DIM MILLIMETERS
G
Q
_
9.9 + 0.2
A
B
C
D
E
F
B
15.95 MAX
1.3+0.1/-0.05
_
0.8 + 0.1
FEATURES
_
3.6 0.2
+
VDSS=500V, ID=10A
Drain-Source ON Resistance :
K
_
2.8 + 0.1
P
3.7
0.5+0.1/-0.05
1.5
G
H
I
M
N
L
RDS(ON)(Max)=0.65
Qg(typ.)= 19.5nC
· trr(typ) = 170ns
@VGS=10V
J
D
_
13.08 + 0.3
J
1.46
H
K
L
M
N
O
P
N
_
1.4 0.1
+
_
1.27 0.1
+
_
2.54 0.2
+
MAXIMUM RATING (Tc=25
)
_
4.5 0.2
+
_
2.4 0.2
+
_
9.2 +0.2
RATING
1
2
3
1. GATE
2. DRAIN
3. SOURCE
CHARACTERISTIC
SYMBOL
UNIT
Q
KF10N50PR
KF10N50FR
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
@TC=25
500
30
V
V
TO-220AB
10
5
10*
5*
ID
Drain Current
A
KF10N50FR
@TC=100
C
A
IDP
Pulsed (Note1)
25
25*
Single Pulsed Avalanche Energy
(Note 2)
EAS
300
14.7
4.5
mJ
mJ
DIM MILLIMETERS
E
Repetitive Avalanche Energy
(Note 1)
EAR
_
10.16 0.2
+
A
B
C
D
E
_
15.87 0.2
+
Peak Diode Recovery dv/dt
(Note 3)
_
2.54 0.2
+
dv/dt
V/ns
_
0.8 0.1
+
_
+
3.18
0.1
130
41.5
0.33
W
Tc=25
Drain Power
Dissipation
_
F
3.3 0.1
+
PD
_
G
H
J
12.57 0.2
+
1.04
Derate above 25
W/
L
M
_
0.5 0.1
+
R
_
+
13.0 0.5
Tj
Maximum Junction Temperature
Storage Temperature Range
150
_
K
L
3.23 0.1
+
D
Tstg
-55 150
1.47 MAX
1.47 MAX
M
N
O
Q
R
N
N
H
Thermal Characteristics
_
2.54 0.2
+
_
6.68 0.2
+
RthJC
RthJA
Thermal Resistance, Junction-to-Case
0.96
62.5
3.0
/W
/W
_
4.7
+
_
0.2
1. GATE
2. DRAIN
3. SOURCE
2.76 0.2
+
Thermal Resistance,
Junction-to-Ambient
1
2
3
62.5
* : Drain current limited by maximum junction temperature.
PIN CONNECTION
TO-220IS (1)
(KF10N50PR, KF10N50FR)
D
G
S
2008. 11. 19
Revision No : 0
1/7