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KC80526GY850256SL547 PDF预览

KC80526GY850256SL547

更新时间: 2024-11-25 19:48:55
品牌 Logo 应用领域
英特尔 - INTEL 外围集成电路
页数 文件大小 规格书
68页 1464K
描述
RISC Microprocessor, 32-Bit, 850MHz, CMOS, PBGA486

KC80526GY850256SL547 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:unknownHTS代码:8542.31.00.01
风险等级:5.86位大小:32
JESD-30 代码:R-PBGA-B486端子数量:486
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA486,24X21,50封装形状:RECTANGULAR
封装形式:GRID ARRAY电源:1.5 V
认证状态:Not Qualified速度:850 MHz
子类别:Microprocessors最大压摆率:17600 mA
标称供电电压:1.5 V表面贴装:YES
技术:CMOS端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

KC80526GY850256SL547 数据手册

 浏览型号KC80526GY850256SL547的Datasheet PDF文件第2页浏览型号KC80526GY850256SL547的Datasheet PDF文件第3页浏览型号KC80526GY850256SL547的Datasheet PDF文件第4页浏览型号KC80526GY850256SL547的Datasheet PDF文件第5页浏览型号KC80526GY850256SL547的Datasheet PDF文件第6页浏览型号KC80526GY850256SL547的Datasheet PDF文件第7页 
Intel® Pentium® III Processor Low  
Power  
700 MHz, 500 MHz and 400 MHz Processors in a BGA2 Package  
Datasheet  
Product Features  
I Processor core/bus speeds:  
700/100 MHz  
I Power Management Features  
Quick Start and Deep Sleep modes  
provide low power dissipation  
500/100 MHz  
I On-die thermal diode  
400/100 MHz  
I Fully compatible with previous Intel  
I Supports the Intel Architecture with  
microprocessors  
Dynamic Execution  
Binary compatible with all applications  
Support for Intel® MMXtechnology  
Support for Streaming SIMD Extensions  
I BGA2 packaging technology  
I On-die primary 16-Kbyte instruction cache  
and 16-Kbyte write-back data cache  
I On-die second level cache (256-Kbyte)  
I Integrated GTL+ termination  
I Integrated math coprocessor  
Supports thin form factor designs  
I Intel Processor Serial Number  
Exposed die enables more efficient heat  
dissipation  
Order Number: 273500-003  
April 2002  

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