生命周期: | Obsolete | 零件包装代码: | SOIC |
包装说明: | 12 X 17 MM, 0.70 MM HEIGHT, PLASTIC, WSOP1-48 | 针数: | 48 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.B.1.A |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.83 |
最长访问时间: | 30 ns | 其他特性: | CONTAINS ADDITIONAL 8M BIT NAND FLASH |
JESD-30 代码: | R-PDSO-G48 | 长度: | 15.4 mm |
内存密度: | 268435456 bit | 内存集成电路类型: | FLASH |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 48 | 字数: | 33554432 words |
字数代码: | 32000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 32MX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VSSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | 并行/串行: | PARALLEL |
编程电压: | 2.7 V | 认证状态: | Not Qualified |
座面最大高度: | 0.7 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
类型: | NAND TYPE | 宽度: | 12 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K9F5608U0B-VIB0 | SAMSUNG |
获取价格 |
32M x 8 Bit , 16M x 16 Bit NAND Flash Memory | |
K9F5608U0B-VIB00 | SAMSUNG |
获取价格 |
Flash, 32MX8, 30ns, PDSO48, 12 X 17 MM, 0.70 MM HEIGHT, PLASTIC, WSOP1-48 | |
K9F5608U0B-YCB0 | SAMSUNG |
获取价格 |
32M x 8 Bit , 16M x 16 Bit NAND Flash Memory | |
K9F5608U0B-YCB00 | SAMSUNG |
获取价格 |
Flash, 32MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | |
K9F5608U0B-YIB0 | SAMSUNG |
获取价格 |
32M x 8 Bit , 16M x 16 Bit NAND Flash Memory | |
K9F5608U0B-YIB00 | SAMSUNG |
获取价格 |
Flash, 32MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | |
K9F5608U0C | SAMSUNG |
获取价格 |
512Mb/256Mb 1.8V NAND Flash Errata | |
K9F5608U0C-D | SAMSUNG |
获取价格 |
512Mb/256Mb 1.8V NAND Flash Errata | |
K9F5608U0C-DCB0 | SAMSUNG |
获取价格 |
512Mb/256Mb 1.8V NAND Flash Errata | |
K9F5608U0C-DCB00 | SAMSUNG |
获取价格 |
Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, TBGA-63 |