是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | TSOP2 | 包装说明: | TSOP2, |
针数: | 44 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.2.A | HTS代码: | 8542.32.00.41 |
风险等级: | 5.89 | 最长访问时间: | 55 ns |
JESD-30 代码: | R-PDSO-G44 | 长度: | 18.41 mm |
内存密度: | 4194304 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 44 | 字数: | 262144 words |
字数代码: | 256000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 256KX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSOP2 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE | 并行/串行: | PARALLEL |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | GULL WING | 端子节距: | 0.8 mm |
端子位置: | DUAL | 宽度: | 10.16 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K6T4016C3C-RF70 | SAMSUNG |
获取价格 |
Standard SRAM, 256KX16, 70ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44 | |
K6T4016C3C-TB55 | SAMSUNG |
获取价格 |
Standard SRAM, 256KX16, 55ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | |
K6T4016C3C-TB550 | SAMSUNG |
获取价格 |
Standard SRAM, 256KX16, 55ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | |
K6T4016C3C-TB70 | SAMSUNG |
获取价格 |
Standard SRAM, 256KX16, 70ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | |
K6T4016C3C-TB700 | SAMSUNG |
获取价格 |
Standard SRAM, 256KX16, 70ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | |
K6T4016C3C-TF55 | SAMSUNG |
获取价格 |
Standard SRAM, 256KX16, 55ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | |
K6T4016C3C-TF70 | SAMSUNG |
获取价格 |
Standard SRAM, 256KX16, 70ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | |
K6T4016C3C-TF700 | SAMSUNG |
获取价格 |
Standard SRAM, 256KX16, 70ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | |
K6T4016C3C-TF70T | SAMSUNG |
获取价格 |
Standard SRAM, 256KX16, 70ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | |
K6T4016S3C-RF100 | SAMSUNG |
获取价格 |
Standard SRAM, 256KX16, 100ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44 |