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K6F2008S2M-TI150 PDF预览

K6F2008S2M-TI150

更新时间: 2024-12-01 15:36:03
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
9页 138K
描述
Standard SRAM, 256KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32

K6F2008S2M-TI150 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP1包装说明:TSOP1,
针数:32Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.91最长访问时间:150 ns
JESD-30 代码:R-PDSO-G32长度:18.4 mm
内存密度:2097152 bit内存集成电路类型:STANDARD SRAM
内存宽度:8功能数量:1
端子数量:32字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.3 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL宽度:8 mm
Base Number Matches:1

K6F2008S2M-TI150 数据手册

 浏览型号K6F2008S2M-TI150的Datasheet PDF文件第2页浏览型号K6F2008S2M-TI150的Datasheet PDF文件第3页浏览型号K6F2008S2M-TI150的Datasheet PDF文件第4页浏览型号K6F2008S2M-TI150的Datasheet PDF文件第5页浏览型号K6F2008S2M-TI150的Datasheet PDF文件第6页浏览型号K6F2008S2M-TI150的Datasheet PDF文件第7页 
K6F2008V2M, K6F2008S2M, K6F2008R2M Family  
CMOS SRAM  
Document Title  
256Kx8 bit Super Low Power and Low Voltage Full CMOS Static RAM  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
0.1  
Initial draft  
October 2, 1996  
Advance  
Revise  
December 1, 1996  
Preliminary  
- Remove sTSOP1 from product  
- Rename high power product to low power.  
ISB1=10.0mA(Max)  
- Add super low power version with special handling  
ISB1=1.0mA(Max)  
- Remove 70ns and add 85ns part on KM68F2000 Family  
1.0  
2.0  
Finalize  
April 11, 1997  
March 5, 1998  
Final  
Final  
Revise  
- Change datasheet format  
- Remove reverse type package from product  
- Remove reseved speed bin(100ns)  
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and  
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.  
Revision 2.0  
1
March 1998  

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