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K6F1008R2M-TC30 PDF预览

K6F1008R2M-TC30

更新时间: 2024-01-21 14:09:02
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
11页 222K
描述
Standard SRAM, 128KX8, 300ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32

K6F1008R2M-TC30 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP1包装说明:TSOP1,
针数:32Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.41
风险等级:5.89最长访问时间:300 ns
JESD-30 代码:R-PDSO-G32长度:18.4 mm
内存密度:1048576 bit内存集成电路类型:STANDARD SRAM
内存宽度:8功能数量:1
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):1.8 V
标称供电电压 (Vsup):2 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL宽度:8 mm
Base Number Matches:1

K6F1008R2M-TC30 数据手册

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K6F1008V2M, K6F1008S2M, K6F1008R2M Family  
CMOS SRAM  
Document Title  
128K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
0.1  
Initial draft  
March 15, 1996  
July 7, 1996  
Advance  
Revise  
Preliminary  
- Erase 100ns from KM68FS1000 Family  
- Add 150ns for KM68FS1000 Family  
- Add 32-sTSOP1 new package  
- Add high power version  
ISB1=5.0mA(Max)  
- Change VDR(Min) 1.0 to 1.5V  
1.0  
Finalize  
December 1, 1996  
Final  
- Concept change high power version to low low power version  
ISB1=5.0mA(Max)  
- Change super low power version with special handling  
ISB1=1.0mA(Max)  
- Icc & Icc1(Read) decrease 10 to 5mA  
2.0  
3.0  
Revise  
February 26, 1998  
July 29, 1998  
Final  
Final  
- Change datasheet format  
- Remove reverse type package from product  
- Remove reserved speed bin(100ns)  
Revise  
- Add CSP type packaged product.  
- Improved ICC2  
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserves the right to change the specifications and  
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.  
Revision 3.0  
1
July 1998  

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