5秒后页面跳转
K4S640832D-TC/L1H PDF预览

K4S640832D-TC/L1H

更新时间: 2022-12-12 15:44:23
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器
页数 文件大小 规格书
10页 130K
描述
64Mbit SDRAM 2M x 8Bit x 4 Banks Synchronous DRAM LVTTL

K4S640832D-TC/L1H 数据手册

 浏览型号K4S640832D-TC/L1H的Datasheet PDF文件第4页浏览型号K4S640832D-TC/L1H的Datasheet PDF文件第5页浏览型号K4S640832D-TC/L1H的Datasheet PDF文件第6页浏览型号K4S640832D-TC/L1H的Datasheet PDF文件第7页浏览型号K4S640832D-TC/L1H的Datasheet PDF文件第8页浏览型号K4S640832D-TC/L1H的Datasheet PDF文件第9页 
K4S640832D  
CMOS SDRAM  
SIMPLIFIED TRUTH TABLE  
A
11,  
CKEn-1 CKEn  
CS  
RAS  
CAS  
WE  
DQM BA0,1  
A10/AP  
Note  
Command  
A
9
~ A  
0
Register  
Refresh  
Mode register set  
Auto refresh  
H
H
X
H
L
L
L
L
L
X
OP code  
X
1,2  
3
L
L
L
H
X
X
Entry  
3
Self  
L
H
L
H
X
L
H
X
H
H
X
H
3
refresh  
Exit  
L
H
X
3
Bank active & row addr.  
H
H
X
X
X
X
V
V
Row address  
Column  
address  
(A0 ~ A8)  
Read &  
column address  
Auto precharge disable  
Auto precharge enable  
Auto precharge disable  
Auto precharge enable  
L
H
L
4
4,5  
4
L
L
H
H
L
L
H
L
Column  
address  
(A0 ~ A8)  
Write &  
Column Address  
H
X
X
V
H
4,5  
6
Burst stop  
Precharge  
H
H
X
X
L
L
H
L
H
H
L
L
X
X
X
Bank selection  
All banks  
V
X
L
X
H
H
L
X
V
X
X
H
X
V
X
X
H
X
V
X
X
H
X
V
X
V
X
X
H
X
V
Entry  
H
L
X
Clock suspend or  
active power down  
X
X
Exit  
L
H
L
X
H
L
X
X
Entry  
H
Precharge power down mode  
H
L
Exit  
L
H
X
X
DQM  
H
H
V
X
X
X
7
H
L
X
H
X
H
No operation command  
(V=Valid, X=Don¢t care, H=Logic high, L=Logic low)  
Notes :  
1. OP Code : Operand code  
A0 ~ A11 & BA0 ~ BA1 : Program keys. (@ MRS)  
2. MRS can be issued only at all banks precharge state.  
A new command can be issued after 2 CLK cycles of MRS.  
3. Auto refresh functions are as same as CBR refresh of DRAM.  
The automatical precharge without row precharge command is meant by "Auto".  
Auto/self refresh can be issued only at all banks precharge state.  
4. BA0 ~ BA1 : Bank select addresses.  
If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected.  
If both BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank B is selected.  
If both BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank C is selected.  
If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected.  
If A10/AP is "High" at row precharge, BA0 and BA1 is ignored and all banks are selected.  
5. During burst read or write with auto precharge, new read/write command can not be issued.  
Another bank read/write command can be issued after the end of burst.  
New row active of the associated bank can be issued at tRP after the end of burst.  
6. Burst stop command is valid at every burst length.  
7. DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (Write DQM latency is 0),  
but makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)  
Rev. 0.0 May 1999  

与K4S640832D-TC/L1H相关器件

型号 品牌 描述 获取价格 数据表
K4S640832D-TC/L1L SAMSUNG 64Mbit SDRAM 2M x 8Bit x 4 Banks Synchronous DRAM LVTTL

获取价格

K4S640832D-TC/L75 SAMSUNG 64Mbit SDRAM 2M x 8Bit x 4 Banks Synchronous DRAM LVTTL

获取价格

K4S640832D-TC/L80 SAMSUNG 64Mbit SDRAM 2M x 8Bit x 4 Banks Synchronous DRAM LVTTL

获取价格

K4S640832D-TC10 SAMSUNG Synchronous DRAM, 8MX8, 7ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54

获取价格

K4S640832D-TC10T SAMSUNG Synchronous DRAM, 8MX8, 7ns, CMOS, PDSO54

获取价格

K4S640832D-TC1H SAMSUNG Synchronous DRAM, 8MX8, 6ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54

获取价格