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K4S510832B-UL750 PDF预览

K4S510832B-UL750

更新时间: 2024-11-21 14:51:47
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
15页 149K
描述
Synchronous DRAM, 64MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-54

K4S510832B-UL750 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2,
针数:54Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.28
风险等级:5.7Is Samacsys:N
访问模式:FOUR BANK PAGE BURST最长访问时间:5.4 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDSO-G54
JESD-609代码:e6长度:22.22 mm
内存密度:536870912 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:8湿度敏感等级:3
功能数量:1端口数量:1
端子数量:54字数:67108864 words
字数代码:64000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:64MX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1.2 mm
自我刷新:YES最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Bismuth (Sn/Bi)
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10.16 mmBase Number Matches:1

K4S510832B-UL750 数据手册

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CMOS SDRAM  
SDRAM 512Mb B-die (x4, x8, x16)  
512Mb B-die SDRAM Specification  
54 TSOP-II with Pb-Free  
(RoHS compliant)  
Revision 1.1  
August 2004  
* Samsung Electronics reserves the right to change products or specification without notice.  
Revision. 1.1 August 2004  

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