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K4M641633K-BL1HT PDF预览

K4M641633K-BL1HT

更新时间: 2024-11-12 09:12:03
品牌 Logo 应用领域
三星 - SAMSUNG 时钟动态存储器内存集成电路
页数 文件大小 规格书
12页 113K
描述
Synchronous DRAM, 4MX16, 7ns, CMOS, PBGA54

K4M641633K-BL1HT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:FBGA, BGA54,9X9,32
Reach Compliance Code:compliant风险等级:5.84
最长访问时间:7 ns最大时钟频率 (fCLK):111 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:S-PBGA-B54JESD-609代码:e3
内存密度:67108864 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:16湿度敏感等级:1
端子数量:54字数:4194304 words
字数代码:4000000最高工作温度:70 °C
最低工作温度:-25 °C组织:4MX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA54,9X9,32
封装形状:SQUARE封装形式:GRID ARRAY, FINE PITCH
峰值回流温度(摄氏度):225电源:3/3.3 V
认证状态:Not Qualified刷新周期:4096
连续突发长度:1,2,4,8,FP最大待机电流:0.0005 A
子类别:DRAMs最大压摆率:0.11 mA
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:MATTE TIN
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED

K4M641633K-BL1HT 数据手册

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K4M641633K - R(B)N/G/L/F  
Mobile-SDRAM  
1M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA  
FEATURES  
GENERAL DESCRIPTION  
• 3.0V & 3.3V power supply.  
The K4M641633K is 67,108,864 bits synchronous high data  
rate Dynamic RAM organized as 4 x 1,048,576 words by 16 bits,  
fabricated with SAMSUNG’s high performance CMOS technol-  
ogy. Synchronous design allows precise cycle control with the  
use of system clock and I/O transactions are possible on every  
clock cycle. Range of operating frequencies, programmable  
burst lengths and programmable latencies allow the same  
device to be useful for a variety of high bandwidth and high per-  
formance memory system applications.  
• LVCMOS compatible with multiplexed address.  
• Four banks operation.  
• MRS cycle with address key programs.  
-. CAS latency (1, 2 & 3).  
-. Burst length (1, 2, 4, 8 & Full page).  
-. Burst type (Sequential & Interleave).  
• EMRS cycle with address key programs.  
• All inputs are sampled at the positive going edge of the system  
clock.  
• Burst read single-bit write operation.  
• Special Function Support.  
-. PASR (Partial Array Self Refresh).  
-. Internal TCSR (Temperature Compensated Self Refresh)  
-. DS (Driver Strength)  
• DQM for masking.  
• Auto refresh.  
• 64ms refresh period (4K cycle).  
• Commercial Temperature Operation (-25°C ~ 70°C).  
• Extended Temperature Operation (-25°C ~ 85°C).  
• 54Balls FBGA( -RXXX -Pb, -BXXX -Pb Free).  
ORDERING INFORMATION  
Part No.  
Max Freq.  
Interface  
Package  
K4M641633K-R(B)N/G/L/F75  
K4M641633K-R(B)N/G/L/F1H  
K4M641633K-R(B)N/G/L/F1L  
133MHz(CL=3),111MHz(CL=2)  
111MHz(CL=2)  
54 FBGA Pb  
(Pb Free)  
LVCMOS  
111MHz(CL=3)*1,83MHz(CL=2)  
- R(B)N/G : Low Power, Extended Temperature(-25°C ~ 85°C)  
- R(B)L/F : Low Power, Commercial Temperature(-25°C ~ 70°C)  
NOTES :  
1. In case of 40MHz Frequency, CL1 can be supported.  
2. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.  
Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific pur  
pose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.  
1
January 2006  

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