生命周期: | Obsolete | 零件包装代码: | TSOP2 |
包装说明: | TSOP2, | 针数: | 66 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.02 | 风险等级: | 5.84 |
访问模式: | FOUR BANK PAGE BURST | 最长访问时间: | 0.7 ns |
其他特性: | AUTO/SELF REFRESH | JESD-30 代码: | R-PDSO-G66 |
长度: | 22.22 mm | 内存密度: | 67108864 bit |
内存集成电路类型: | DDR DRAM | 内存宽度: | 16 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 66 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 65 °C | 最低工作温度: | |
组织: | 4MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSOP2 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 自我刷新: | YES |
最大供电电压 (Vsup): | 3.465 V | 最小供电电压 (Vsup): | 3.135 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 宽度: | 10.16 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K4D64163HE-TC50 | SAMSUNG |
获取价格 |
DDR DRAM, 4MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | |
K4D64163HE-TC55 | SAMSUNG |
获取价格 |
DDR DRAM, 4MX16, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | |
K4D64163HE-TC550 | SAMSUNG |
获取价格 |
DDR DRAM, 4MX16, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | |
K4D64163HE-TC60 | SAMSUNG |
获取价格 |
DDR DRAM, 4MX16, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | |
K4D64163HE-TC600 | SAMSUNG |
获取价格 |
DDR DRAM, 4MX16, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | |
K4D64163HF | SAMSUNG |
获取价格 |
1M x 16Bit x 4 Banks Double Data Rate Synchronous DRAM | |
K4D64163HF-TC33 | SAMSUNG |
获取价格 |
1M x 16Bit x 4 Banks Double Data Rate Synchronous DRAM | |
K4D64163HF-TC36 | SAMSUNG |
获取价格 |
1M x 16Bit x 4 Banks Double Data Rate Synchronous DRAM | |
K4D64163HF-TC40 | SAMSUNG |
获取价格 |
1M x 16Bit x 4 Banks Double Data Rate Synchronous DRAM | |
K4D64163HF-TC50 | SAMSUNG |
获取价格 |
1M x 16Bit x 4 Banks Double Data Rate Synchronous DRAM |