ISL70001ASEH
Absolute Maximum Ratings
Thermal Information
AVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AGND - 0.3V to AGND + 6.5V
DVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DGND - 0.3V to DGND +6.5V
LXx, PVINx . . . . . . . . . . . . . . . . . . . . . . . . . . . PGNDx - 0.3V to PGNDx + 6.5V
AVDD - AGND, DVDD - DGND . . . . . . . . . . . . . . . . . . . . PVINx - PGNDx ± 0.3V
Signal pins (Note 9) . . . . . . . . . . . . . . . . . . . . . AGND - 0.3V to AVDD + 0.3V
Digital control pins (Note 10) . . . . . . . . . . . . . DGND - 0.3V to DVDD + 0.3V
PGOOD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .DGND - 0.3V to DGND + 6.5V
SS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .DGND - 0.3V to DGND + 2.5V
Thermal Resistance (Typical)
48 Ld CQFP R48.A (Notes 4, 6) . . . . . . . . .
48 Ld CQFP R48.B (Notes 5, 7) . . . . . . . . .
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+145°C
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
θ
JA (°C/W)
36.5
θ
JC (°C/W)
3
1.3
19
Recommended Operating Conditions
Absolute Maximum Ratings (NOTE 8)
AVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AGND - 0.3V to AGND + 5.7V
DVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .DGND - 0.3V to DGND + 5.7V
LXx, PVINx . . . . . . . . . . . . . . . . . . . . . . . . . . . PGNDx - 0.3V to PGNDx + 5.7V
AVDD - AGND, DVDD - DGND . . . . . . . . . . . . . . . . . . . . PVINx - PGNDx ± 0.3V
Signal pins (Note 9) . . . . . . . . . . . . . . . . . . . . . AGND - 0.3V to AVDD + 0.3V
Digital control pins (Note 10) . . . . . . . . . . . . . DGND - 0.3V to DVDD + 0.3V
PGOOD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .DGND - 0.3V to DGND + 5.7V
SS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .DGND - 0.3V to DGND + 2.5V
AVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AGND + 3V to 5.5V
DVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DGND + 3V to 5.5V
PVINx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PGNDx + 3V to 5.5V
AVDD - AGND, DVDD - DGND . . . . . . . . . . . . . . . . . . . . PVINx - PGNDx ± 0.1V
Signal pins (Note 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AGND to AVDD
Digital control pins (Note 10) . . . . . . . . . . . . . . . . . . . . . . . . .DGND to DVDD
REF, SS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internally Set
GND, TDI, TDO, TPGM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DGND
I
(T ≤ +145°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0A to 1.0A
LXx
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C
J
ESD Rating
Human Body Model (Tested per MIL-PRF-883 3015.7). . . . . . . . . . . 2kV
Machine Model (Tested per JESD22-A115-A). . . . . . . . . . . . . . . . . 200V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
5. θ is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
JA
Brief TB379
6. For θ , the “case temp” location is the center of the package underside.
JC
7. For θ , the “case temp” location is the center of the exposed metal pad on the package underside.
JC
2
8. For operation in a heavy ion environment at LET = 86.4 MeV•cm /mg with +125°C (T ).
C
9. EN, FB, PORSEL and REF pins.
10. M/S, SYNC, TDI, TDO and ZAP pins
V
Electrical Specifications Unless otherwise noted, VIN = AVDD = DVDD = PVINx = EN = M/S = 3V or 5.5V;
GND = AGND = DGND = PGNDx = TDI = TDO = ZAP = 0V; FB = 0.65V; PORSEL = VIN for 4.5V ≤ VIN ≤ 5.5V and GND for V < 4.5V,
IN
SYNC = LXx = Open Circuit; PGOOD is pulled up to V with a 1k resistor; REF is bypassed to GND with a 220nF capacitor; SS is bypassed to GND with a
IN
100nF capacitor; I
OUT
= 0A; T = T = +25°C. (Note 11). Boldface limits apply over the operating temperature range, -55°C to +125°C; over a total iodizing
A J
dose of 100krad(Si) with exposure at a high dose rate of 50 - 300krad(Si)/s; and over a total iodizing dose of 50krad(Si) with exposure at a low dose rate
of <10mrad(Si)/s.
MIN
TYP
MAX
PARAMETER
POWER SUPPLY
TEST CONDITIONS
(Note 12) (Note 11) (Note 12)
UNITS
Operating Supply Current
V
V
V
V
= 5.5V
= 3.6V
40
25
2
65
45
6
mA
mA
mA
mA
IN
IN
IN
IN
Shutdown Supply Current
= 5.5V, EN = GND
= 3.6V, EN = GND
1.5
4.5
OUTPUT VOLTAGE
Reference Voltage Tolerance
Output Voltage Tolerance
0.594
-2
0.6
0
0.606
2
V
V
V
I
= 0.8V to 2.5V for V = 4.5V to 5.5V,
IN
%
OUT
OUT
OUT
= 0.8V to 2.5V for V = 3V to 3.6V,
IN
= 0A to 6A (Notes 13, 14)
Feedback (FB) Input Leakage Current
V
= 5.5V, V = 0.6V
FB
-1
0
1
µA
IN
FN8365.0
May 22, 2013
7
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