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IS61NLF102436B-6.5TQLI PDF预览

IS61NLF102436B-6.5TQLI

更新时间: 2024-02-10 07:26:29
品牌 Logo 应用领域
美国芯成 - ISSI 静态存储器内存集成电路
页数 文件大小 规格书
37页 1622K
描述
ZBT SRAM, 1MX36, 6.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, TQFP-100

IS61NLF102436B-6.5TQLI 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:QFP包装说明:LQFP,
针数:100Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
Factory Lead Time:10 weeks风险等级:5.74
最长访问时间:6.5 nsJESD-30 代码:R-PQFP-G100
长度:20 mm内存密度:37748736 bit
内存集成电路类型:ZBT SRAM内存宽度:36
功能数量:1端子数量:100
字数:1048576 words字数代码:1000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:1MX36
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
座面最大高度:1.6 mm最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

IS61NLF102436B-6.5TQLI 数据手册

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IS61(64)NLF102436B/IS61(64)NVF/NVVF102436B  
IS61(64)NLF204818B/IS61(64)NVF/NVVF204818B  
MAY 2015  
1M x 36, 2M x 18  
36Mb, FLOW THROUGH 'NO WAIT' STATE BUS SRAM  
FEATURES  
DESCRIPTION  
The 36 Meg product family features high-speed, low-power  
synchronous static RAMs designed to provide a burstable,  
high-performance, 'no wait' state, device for networking  
and communications applications. They are organized as  
1,048,476 words by 36 bits and 2,096,952 words by 18  
• 100 percent bus utilization  
• No wait cycles between Read and Write  
• Internal self-timed write cycle  
• Individual Byte Write Control  
• Single Read/Write control pin  
bits, fabricated with ISSI's advanced CMOS technology.  
Incorporating a 'no wait' state feature, wait cycles are  
eliminated when the bus switches from read to write, or  
write to read. This device integrates a 2-bit burst counter,  
high-speed SRAM core, and high-drive capability outputs  
into a single monolithic circuit.  
• Clock controlled, registered address,  
data and control  
• Interleaved or linear burst sequence control us-  
ing MODE input  
Allsynchronousinputspassthroughregistersarecontrolled  
byapositive-edge-triggeredsingleclockinput.Operations  
may be suspended and all synchronous inputs ignored  
when Clock Enable, CKE is HIGH. In this state the internal  
device will hold their previous values.  
• Three chip enables for simple depth expansion  
and address pipelining  
• Power Down mode  
• Common data inputs and data outputs  
CKE pin to enable clock and suspend operation  
AllRead,WriteandDeselectcyclesareinitiatedbytheADV  
input. When the ADV is HIGH the internal burst counter  
is incremented. New external addresses can be loaded  
when ADV is LOW.  
• JEDEC 100-pin TQFP, 119-ball PBGA, and 165-  
ball PBGA packages  
Write cycles are internally self-timed and are initiated  
by the rising edge of the clock inputs and when WE is  
LOW. Separate byte enables allow individual bytes to be  
written.  
• Power supply:  
NLF: Vdd 3.3V (± 5%), Vddq 3.3V/2.5V (± 5%)  
NVF: Vdd 2.5V (± 5%), Vddq 2.5V (± 5%)  
NVVF: Vdd 1.8V (± 5%), Vddq 1.8V (± 5%)  
A burst mode pin (MODE) defines the order of the burst  
sequence.WhentiedHIGH,theinterleavedburstsequence  
is selected. When tied LOW, the linear burst sequence is  
selected.  
• JTAG Boundary Scan for PBGA packages  
• Industrial temperature available  
• Lead-free available  
FAST ACCESS TIME  
Symbol  
Parameter  
6.5  
6.5  
7.5  
133  
7.5  
7.5  
8.5  
117  
Units  
ns  
tkq  
Clock Access Time  
Cycle Time  
tkc  
ns  
Frequency  
MHz  
Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no  
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on  
any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause  
failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written  
assurance to its satisfaction, that:  
a.) the risk of injury or damage has been minimized;  
b.) the user assume all such risks; and  
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
1
Rev. A  
04/17/2015  

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