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IRL3705ZSTRR PDF预览

IRL3705ZSTRR

更新时间: 2024-10-01 21:08:31
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网开关脉冲晶体管
页数 文件大小 规格书
12页 377K
描述
Power Field-Effect Transistor, 75A I(D), 55V, 0.008ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, PLASTIC, D2PAK-3

IRL3705ZSTRR 数据手册

 浏览型号IRL3705ZSTRR的Datasheet PDF文件第2页浏览型号IRL3705ZSTRR的Datasheet PDF文件第3页浏览型号IRL3705ZSTRR的Datasheet PDF文件第4页浏览型号IRL3705ZSTRR的Datasheet PDF文件第5页浏览型号IRL3705ZSTRR的Datasheet PDF文件第6页浏览型号IRL3705ZSTRR的Datasheet PDF文件第7页 
PD - 95579A  
IRL3705ZPbF  
IRL3705ZSPbF  
Features  
IRL3705ZLPbF  
HEXFET® Power MOSFET  
l
l
l
l
l
l
l
Logic Level  
Advanced Process Technology  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free  
D
VDSS = 55V  
RDS(on) = 8.0mΩ  
G
Description  
ID = 75A  
S
ThisHEXFET® PowerMOSFETutilizesthelatest  
processing techniques to achieve extremely low  
on-resistancepersiliconarea.Additionalfeatures  
of this design are a 175°C junction operating  
temperature, fast switching speed and improved  
repetitive avalanche rating. These features  
combinetomakethisdesignanextremelyefficient  
and reliable device for use in a wide variety of  
applications.  
D2Pak  
IRL3705ZSPbF IRL3705ZLPbF  
TO-262  
TO-220AB  
IRL3705ZPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
(Silicon Limited)  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
I
@ T = 25°C  
C
86  
D
D
D
@ T = 100°C  
C
61  
A
(Package Limited)  
@ T = 25°C  
C
75  
340  
DM  
P
@T = 25°C Power Dissipation  
C
130  
W
W/°C  
V
D
Linear Derating Factor  
0.88  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
± 16  
GS  
EAS (Thermally limited)  
120  
180  
mJ  
EAS (Tested )  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
Repetitive Avalanche Energy  
Operating Junction and  
mJ  
T
J
-55 to + 175  
T
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
°C  
STG  
300 (1.6mm from case )  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
Max.  
Units  
RθJC  
RθCS  
RθJA  
RθJA  
Junction-to-Case  
–––  
0.50  
–––  
–––  
1.14  
–––  
62  
°C/W  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
Junction-to-Ambient (PCB Mount)  
40  
www.irf.com  
1
10/01/10  

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