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IRL2203NLPBF PDF预览

IRL2203NLPBF

更新时间: 2024-01-10 02:08:53
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
11页 227K
描述
HEXFET㈢ Power MOSFET

IRL2203NLPBF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.07其他特性:LOGIC LEVEL COMPATIBLE
外壳连接:DRAIN配置:SINGLE
最小漏源击穿电压:30 V最大漏极电流 (ID):92 A
最大漏源导通电阻:0.01 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
功耗环境最大值:150 W认证状态:Not Qualified
表面贴装:YES端子面层:MATTE TIN OVER NICKEL
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRL2203NLPBF 数据手册

 浏览型号IRL2203NLPBF的Datasheet PDF文件第2页浏览型号IRL2203NLPBF的Datasheet PDF文件第3页浏览型号IRL2203NLPBF的Datasheet PDF文件第4页浏览型号IRL2203NLPBF的Datasheet PDF文件第5页浏览型号IRL2203NLPBF的Datasheet PDF文件第6页浏览型号IRL2203NLPBF的Datasheet PDF文件第7页 
PD - 95219  
IRL2203NSPbF  
IRL2203NLPbF  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
HEXFET® Power MOSFET  
D
VDSS = 30V  
l Fully Avalanche Rated  
l 100% RG Tested  
RDS(on) = 7.0mΩ  
G
l Lead-Free  
ID = 116A‡  
S
Description  
Advanced HEXFET® Power MOSFETs from International Rectifier  
utilize advanced processing techniques to achieve extremely low on-  
resistance per silicon area. This benefit, combined with the fast  
switching speed and ruggedized device design that HEXFET power  
MOSFETs are well known for, provides the designer with an extremely  
efficient and reliable device for use in a wide variety of applications.  
The D2Pak is a surface mount power package capable of accommodating  
diesizesuptoHEX-4.Itprovidesthehighestpowercapabilityandthelowest  
possible on-resistance in any existing surface mount package. The D2Pak  
issuitableforhighcurrentapplicationsbecauseofitslowinternalconnection  
resistanceandcandissipateupto2.0Winatypicalsurfacemountapplication.  
Thethrough-holeversion(IRL2203NL)isavailableforlow-profileapplications.  
D2Pak  
IRL2203NS  
TO-262  
IRL2203NL  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max  
116  
Units  
‡
Continuous Drain Current, VGS @ 10V  
I
I
I
@ TC = 25°C  
D
D
Continuous Drain Current, VGS @ 10V  
@ TC = 100°C  
82  
400  
3.8  
180  
A

Pulsed Drain Current  
DM  
P
P
@TA = 25°C  
@TC = 25°C  
Power Dissipation  
Power Dissipation  
W
W
D
D
Linear Derating Factor  
Gate-to-Source Voltage  
1.2  
± 16  
W/°C  
V
V
GS  

Avalanche Current  
IAR  
60  
18  
A

Repetitive Avalanche Energy  
EAR  
mJ  
ƒ
dv/dt  
Peak Diode Recovery dv/dt  
5.0  
V/ns  
Operating Junction and  
T
-55 to + 175  
J
°C  
Storage Temperature Range  
TSTG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case)  
Thermal Resistance  
Symbol  
Parameter  
Typ  
–––  
–––  
Max  
0.85  
40  
Units  
Junction-to-Case ‰  
RθJC  
°C/W  
Junction-to-Ambient (PCB mount, steady state) ˆ‰  
RθJA  
www.irf.com  
1
04/27/04  

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