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IRL2203NSPBF

更新时间: 2024-01-26 15:20:02
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 227K
描述
HEXFET㈢ Power MOSFET

IRL2203NSPBF 数据手册

 浏览型号IRL2203NSPBF的Datasheet PDF文件第2页浏览型号IRL2203NSPBF的Datasheet PDF文件第3页浏览型号IRL2203NSPBF的Datasheet PDF文件第4页浏览型号IRL2203NSPBF的Datasheet PDF文件第5页浏览型号IRL2203NSPBF的Datasheet PDF文件第6页浏览型号IRL2203NSPBF的Datasheet PDF文件第7页 
PD - 95219  
IRL2203NSPbF  
IRL2203NLPbF  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
HEXFET® Power MOSFET  
D
VDSS = 30V  
l Fully Avalanche Rated  
l 100% RG Tested  
RDS(on) = 7.0mΩ  
G
l Lead-Free  
ID = 116A‡  
S
Description  
Advanced HEXFET® Power MOSFETs from International Rectifier  
utilize advanced processing techniques to achieve extremely low on-  
resistance per silicon area. This benefit, combined with the fast  
switching speed and ruggedized device design that HEXFET power  
MOSFETs are well known for, provides the designer with an extremely  
efficient and reliable device for use in a wide variety of applications.  
The D2Pak is a surface mount power package capable of accommodating  
diesizesuptoHEX-4.Itprovidesthehighestpowercapabilityandthelowest  
possible on-resistance in any existing surface mount package. The D2Pak  
issuitableforhighcurrentapplicationsbecauseofitslowinternalconnection  
resistanceandcandissipateupto2.0Winatypicalsurfacemountapplication.  
Thethrough-holeversion(IRL2203NL)isavailableforlow-profileapplications.  
D2Pak  
IRL2203NS  
TO-262  
IRL2203NL  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max  
116  
Units  
‡
Continuous Drain Current, VGS @ 10V  
I
I
I
@ TC = 25°C  
D
D
Continuous Drain Current, VGS @ 10V  
@ TC = 100°C  
82  
400  
3.8  
180  
A

Pulsed Drain Current  
DM  
P
P
@TA = 25°C  
@TC = 25°C  
Power Dissipation  
Power Dissipation  
W
W
D
D
Linear Derating Factor  
Gate-to-Source Voltage  
1.2  
± 16  
W/°C  
V
V
GS  

Avalanche Current  
IAR  
60  
18  
A

Repetitive Avalanche Energy  
EAR  
mJ  
ƒ
dv/dt  
Peak Diode Recovery dv/dt  
5.0  
V/ns  
Operating Junction and  
T
-55 to + 175  
J
°C  
Storage Temperature Range  
TSTG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case)  
Thermal Resistance  
Symbol  
Parameter  
Typ  
–––  
–––  
Max  
0.85  
40  
Units  
Junction-to-Case ‰  
RθJC  
°C/W  
Junction-to-Ambient (PCB mount, steady state) ˆ‰  
RθJA  
www.irf.com  
1
04/27/04  

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