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IRL2203S PDF预览

IRL2203S

更新时间: 2024-01-20 22:14:40
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关
页数 文件大小 规格书
9页 174K
描述
Power MOSFET(Vdss=30V, Rds(on)=0.007ohm, Id=100A)

IRL2203S 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.07其他特性:LOGIC LEVEL COMPATIBLE
外壳连接:DRAIN配置:SINGLE
最小漏源击穿电压:30 V最大漏极电流 (ID):92 A
最大漏源导通电阻:0.01 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
功耗环境最大值:150 W认证状态:Not Qualified
表面贴装:YES端子面层:MATTE TIN OVER NICKEL
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRL2203S 数据手册

 浏览型号IRL2203S的Datasheet PDF文件第2页浏览型号IRL2203S的Datasheet PDF文件第3页浏览型号IRL2203S的Datasheet PDF文件第4页浏览型号IRL2203S的Datasheet PDF文件第5页浏览型号IRL2203S的Datasheet PDF文件第6页浏览型号IRL2203S的Datasheet PDF文件第7页 
PRELIMINARY  
PD 9.1091A  
IRL2203S  
HEXFET® Power MOSFET  
D
l Logic-Level Gate Drive  
l Surface Mount  
VDSS = 30V  
RDS(on) = 0.007Ω  
ID = 100A  
l Advanced Process Technology  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
l Fully Avalanche Rated  
Description  
G
S
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor, providesthedesignerwithanextremelyefficient  
and reliable device for use in a wide variety of applications.  
The D2Pak is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible on-  
resistance in any existing surface mount package. The  
D2Pak is suitable for high current applications because of  
its low internal connection resistance and can dissipate  
up to 2.0W in a typical surface mount application.  
D2Pak  
Absolute Maximum Ratings  
Parameter  
Max.  
100ꢀ  
71  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V†  
Continuous Drain Current, VGS @ 10V†  
Pulsed Drain Current†  
A
400  
PD @TA = 25°C  
PD @TC = 25°C  
PowerDissipation  
3.8  
W
W
PowerDissipation  
130  
LinearDeratingFactor  
0.83  
± 20  
390  
W/°C  
V
VGS  
EAS  
IAR  
Gate-to-SourceVoltage  
SinglePulseAvalancheEnergy‚†  
AvalancheCurrent  
mJ  
A
60  
EAR  
dv/dt  
TJ  
RepetitiveAvalancheEnergy  
PeakDiodeRecoverydv/dtƒ†  
OperatingJunctionand  
13  
mJ  
V/ns  
1.2  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
1.2  
Units  
RθJC  
RθJA  
°C/W  
Junction-to-Ambient ( PCB Mounted,steady-state)**  
–––  
40  

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