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IRFI5210 PDF预览

IRFI5210

更新时间: 2024-10-28 22:24:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 152K
描述
HEXFET Power MOSFET

IRFI5210 数据手册

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PD - 9.1404A  
IRFI5210  
PRELIMINARY  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Isolated Package  
l High Voltage Isolation = 2.5KVRMS  
l Sink to Lead Creepage Dist. = 4.8mm  
l P-Channel  
D
VDSS = -100V  
RDS(on) = 0.06Ω  
G
l Fully Avalanche Rated  
ID = -23A  
S
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor, providesthedesignerwithanextremelyefficient  
and reliable device for use in a wide variety of applications.  
The TO-220 Fullpak eliminates the need for additional  
insulating hardware in commercial-industrial applications.  
The moulding compound used provides a high isolation  
capability and a low thermal resistance between the tab  
and external heatsink. This isolation is equivalent to using  
a 100 micron mica barrier with standard TO-220 product.  
The Fullpak is mounted to a heatsink using a single clip or  
by a single screw fixing.  
TO-220 FULLPAK  
Absolute Maximum Ratings  
Parameter  
Max.  
-23  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current †  
-16  
A
-140  
63  
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
0.42  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
Single Pulse Avalanche Energy‚†  
Avalanche Current†  
690  
mJ  
A
-21  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ†  
Operating Junction and  
6.3  
mJ  
V/ns  
-5.0  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 srew  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient  
Typ.  
–––  
Max.  
2.4  
65  
Units  
RθJC  
RθJA  
°C/W  
–––  
3/16/98  

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