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IRF644NSTRRPBF

更新时间: 2024-11-01 05:39:27
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 171K
描述
Power MOSFET

IRF644NSTRRPBF 技术参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.04Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):180 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:250 V最大漏极电流 (Abs) (ID):14 A
最大漏极电流 (ID):14 A最大漏源导通电阻:0.24 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):150 W
最大脉冲漏极电流 (IDM):56 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF644NSTRRPBF 数据手册

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IRF644N, IRF644NS, IRF644NL, SiHF644N, SiHF644NS, SiHF644NL  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• Advanced Process Technology  
• Dynamic dV/dt Rating  
• 175 °C Operating Temperature  
• Fast Switching  
250 V  
Available  
RDS(on) (Ω)  
Qg (Max.) (nC)  
VGS = 10 V  
0.240  
RoHS*  
COMPLIANT  
54  
9.2  
26  
• Fully Avalanche Rated  
• Ease of Paralleling  
Q
Q
gs (nC)  
gd (nC)  
• Simple Drive Requirements  
• Lead (Pb)-free Available  
Configuration  
D2PAK (TO-263)  
Single  
D
DESCRIPTION  
Fifth generation Power MOSFETs from Vishay utilize  
advanced processing techniques to achieve extremely low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
The TO-220 package is universally preferred for all  
commercial-industrial applications at power dissipation  
levels to approximately 50 W. The low thermal resistance  
and low package cost of the TO-220 contribute to its wide  
acceptance throughout the industry.  
D
S
G
G
I2PAK (TO-262)  
TO-220  
S
N-Channel MOSFET  
S
D
The D2PAK is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible on  
resistance in any existing surface mount package. The  
D2PAK is suitable for high current applications because of its  
low internal connection resistance and can dissipate up to  
2.0 W in a typical surface mount application.  
G
ORDERING INFORMATION  
Package  
TO-220  
D2PAK (TO-263)  
IRF644NSPbF  
SiHF644NS-E3  
IRF644NS  
D2PAK (TO-263)  
IRF644NSTRLPbFa  
SiHF644NSTL-E3a  
IRF644NSTRLa  
D2PAK (TO-263)  
IRF644NSTRRPbFa  
SiHF644NSTR-E3a  
IRF644NSTRRa  
SiHF644NSTRa  
I2PAK (TO-262)  
IRF644NLPbF  
SiHF644NL-E3  
IRF644NL  
IRF644NPbF  
SiHF644N-E3  
IRF644N  
Lead (Pb)-free  
SnPb  
SiHF644N  
SiHF644NS  
SiHF644NSTLa  
SiHF644NL  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
20  
UNIT  
Gate-Source Voltage  
VGS  
V
TC = 25 °C  
TC =100°C  
14  
Continuous Drain Current  
VGS at 10 V  
ID  
9.9  
56  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
Single Pulse Avalanche Energyb  
1.0  
180e  
8.4  
15  
W/°C  
mJ  
A
EAS  
IAR  
Avalanche Current  
Repetitive Avalanche Energy  
Maximum Power Dissipation  
Peak Diode Recovery dV/dtc  
EAR  
PD  
mJ  
W
T
C = 25 °C  
150  
7.9  
dV/dt  
V/ns  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91038  
S-Pending-Rev. A, 19-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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