Data Sheet No. PD65003
IR2127C/IR2128C/IR21271C
CURRENT SENSING SINGLE CHANNEL DRIVERDIE IN
WAFER FORM
Features
c
100 % Tested at Probe
•
•
•
d
Available in Chip Pack, Unsawn Wafer, Sawn on Film
Floating channel designed for bootstrap operation
Fully operational to +600V
Tolerant to negative transient voltage dV/dt immune
Application- specific gate drive range: Motor Drive: 12 to 20V (IR2127/IR2128)
Automotive: 9 to 20V (IR21271)
•
Undervoltage lockout
3.3V, 5V and 15V input logic compatible
•
•
•
•
FAULT
lead indicates shutdown has occured
Output in phase with input (IR2127/IR21271)
Output out of phase with input (IR2128)
•
Typical Connection
VCC
IN
VCC
VB
HO
CS
VS
IN
FAULT
FAULT
COM
VCC
IN
VCC
VB
HO
CS
VS
IR2127/IR21271
IN
(Refer to the Die Outlines for correct pin
configuration). This/These diagram(s) show
electrical connections only. Please refer to
our Application Notes and DesignTips for
proper circuit board layout.
FAULT
FAULT
COM
IR2128
Notes:
c This IR product is100% tested at wafer level and is manufactured using established, mature and well characterized
processes. Due to restrictions in die level processing, die may not be equivalent to standard package products and are
therefore offered with a conditional performance guarantee. The above data sheet is based on IR sample testing under
certain predetermined and assumed conditions, and are provided for illustration purposes only. Customers are encouraged
to perform testing in actual proposed packaged and use conditions. IR die products are tested using IR-based quality
assurance procedures and are manufactured using IR’s established processes. Programs for customer-specified testing
are available upon request. IR has experienced assembly yields of generally 95% or greater for individual die; however,
customer’s results will vary. Estimates such as those described and set forth in this data sheet for semiconductor die will
vary depending on a number of packaging, handling, use and other factors. Sold die may not perform on an equivalent
basis to standard package products and are therefore offered with a limited warranty as described in IR’s applicable
standard terms and conditions of sale. All IR die sales are subject to IR’s applicable standard terms and conditions of sale,
which are available upon request. For customers requiring a particular parameter to be guaranteed, special testing can be
carried out or product can be purchased as known good die.
d Part number shown is for die in wafer. Contact factory for these other options.
www.irf.com
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