Datasheet > IR2128C

IR2128C

更新时间： 2024-02-08 21:03:16

品牌	Logo	应用领域
英飞凌 - INFINEON		/
页数	文件大小	规格书
17页	142K
描述
Buffer/Inverter Based MOSFET Driver, CMOS,

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IR2128C 技术参数

是否Rohs认证：	不符合	生命周期：	End Of Life
包装说明：	, DIE OR CHIP	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.39.00.01
风险等级：	5.7	接口集成电路类型：	BUFFER OR INVERTER BASED MOSFET DRIVER
最高工作温度：	125 °C	最低工作温度：	-40 °C
封装等效代码：	DIE OR CHIP	电源：	15 V
认证状态：	Not Qualified	子类别：	MOSFET Drivers
标称供电电压：	15 V	技术：	CMOS
温度等级：	AUTOMOTIVE	Base Number Matches：	1

IR2128C 数据手册

Data Sheet No. PD65003

IR2127C/IR2128C/IR21271C

CURRENT SENSING SINGLE CHANNEL DRIVERDIE IN

WAFER FORM

Features

100 % Tested at Probe

•

Available in Chip Pack, Unsawn Wafer, Sawn on Film

Floating channel designed for bootstrap operation

Fully operational to +600V

Tolerant to negative transient voltage dV/dt immune

Application- specific gate drive range: Motor Drive: 12 to 20V (IR2127/IR2128)

Automotive: 9 to 20V (IR21271)

•

Undervoltage lockout

3.3V, 5V and 15V input logic compatible

•

FAULT

lead indicates shutdown has occured

Output in phase with input (IR2127/IR21271)

Output out of phase with input (IR2128)

•

Typical Connection

V_CC

V_B

V_S

FAULT

COM

V_CC

V_B

V_S

IR2127/IR21271

(Refer to the Die Outlines for correct pin

configuration). This/These diagram(s) show

electrical connections only. Please refer to

our Application Notes and DesignTips for

proper circuit board layout.

FAULT

COM

IR2128

Notes:

c This IR product is100% tested at wafer level and is manufactured using established, mature and well characterized

processes. Due to restrictions in die level processing, die may not be equivalent to standard package products and are

therefore offered with a conditional performance guarantee. The above data sheet is based on IR sample testing under

certain predetermined and assumed conditions, and are provided for illustration purposes only. Customers are encouraged

to perform testing in actual proposed packaged and use conditions. IR die products are tested using IR-based quality

assurance procedures and are manufactured using IR’s established processes. Programs for customer-specified testing

are available upon request. IR has experienced assembly yields of generally 95% or greater for individual die; however,

customer’s results will vary. Estimates such as those described and set forth in this data sheet for semiconductor die will

vary depending on a number of packaging, handling, use and other factors. Sold die may not perform on an equivalent

basis to standard package products and are therefore offered with a limited warranty as described in IR’s applicable

standard terms and conditions of sale. All IR die sales are subject to IR’s applicable standard terms and conditions of sale,

which are available upon request. For customers requiring a particular parameter to be guaranteed, special testing can be

carried out or product can be purchased as known good die.

d Part number shown is for die in wafer. Contact factory for these other options.

www.irf.com

12 3 4 5 6 7...17

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