是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 324 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.92 | JESD-30 代码: | S-PBGA-B324 |
JESD-609代码: | e0 | 长度: | 19 mm |
湿度敏感等级: | 3 | 端子数量: | 324 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 225 | 认证状态: | Not Qualified |
座面最大高度: | 1.72 mm | 最大供电电压: | 2.625 V |
最小供电电压: | 2.375 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 20 |
宽度: | 19 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IDT72T72105 | IDT |
获取价格 |
2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 72-BIT CONFIGURATIONS | |
IDT72T72105L10BB | IDT |
获取价格 |
2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 72-BIT CONFIGURATIONS | |
IDT72T72105L10BBG | IDT |
获取价格 |
FIFO, 64KX72, 4.5ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, B | |
IDT72T72105L10BBI | IDT |
获取价格 |
2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 72-BIT CONFIGURATIONS | |
IDT72T72105L4BB | IDT |
获取价格 |
2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 72-BIT CONFIGURATIONS | |
IDT72T72105L4BBI | IDT |
获取价格 |
2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 72-BIT CONFIGURATIONS | |
IDT72T72105L5BB | IDT |
获取价格 |
2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 72-BIT CONFIGURATIONS | |
IDT72T72105L5BBG | IDT |
获取价格 |
FIFO, 64KX72, 3.6ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, B | |
IDT72T72105L5BBGI | IDT |
获取价格 |
FIFO, 64KX72, 3.6ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, B | |
IDT72T72105L5BBI | IDT |
获取价格 |
2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 72-BIT CONFIGURATIONS |