是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | 针数: | 324 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.11 | Is Samacsys: | N |
JESD-30 代码: | S-PBGA-B324 | JESD-609代码: | e1 |
长度: | 19 mm | 湿度敏感等级: | 3 |
端子数量: | 324 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1.97 mm |
最大供电电压: | 2.625 V | 最小供电电压: | 2.375 V |
标称供电电压: | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 19 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IDT72T6360L7.5BBGI | IDT |
获取价格 |
Microprocessor Circuit, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | |
IDT72T6360L7.5BBI | IDT |
获取价格 |
Microprocessor Circuit, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | |
IDT72T6360L7-5BBG | IDT |
获取价格 |
Microprocessor Circuit, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | |
IDT72T6360L7-5BBGI | IDT |
获取价格 |
Microprocessor Circuit, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | |
IDT72T6480L10BB | IDT |
获取价格 |
Microprocessor Circuit, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | |
IDT72T6480L10BBI | IDT |
获取价格 |
Microprocessor Circuit, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | |
IDT72T6480L7.5BBI | IDT |
获取价格 |
DRAM | |
IDT72T6480L7-5BBI | IDT |
获取价格 |
Microprocessor Circuit, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | |
IDT72T72105 | IDT |
获取价格 |
2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 72-BIT CONFIGURATIONS | |
IDT72T72105L10BB | IDT |
获取价格 |
2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 72-BIT CONFIGURATIONS |