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IDT71V3576S200BG8 PDF预览

IDT71V3576S200BG8

更新时间: 2024-11-11 15:34:43
品牌 Logo 应用领域
艾迪悌 - IDT 静态存储器内存集成电路
页数 文件大小 规格书
20页 363K
描述
Cache SRAM, 128KX36, 3.1ns, CMOS, PBGA119, BGA-119

IDT71V3576S200BG8 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA-119
针数:119Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.38最长访问时间:3.1 ns
其他特性:ALSO REQUIRES 3.3V I/O SUPPLYJESD-30 代码:R-PBGA-B119
JESD-609代码:e3长度:22 mm
内存密度:4718592 bit内存集成电路类型:CACHE SRAM
内存宽度:36湿度敏感等级:1
功能数量:1端子数量:119
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX36
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:3.5 mm
最大供电电压 (Vsup):3.465 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:MATTE TIN端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:14 mm
Base Number Matches:1

IDT71V3576S200BG8 数据手册

 浏览型号IDT71V3576S200BG8的Datasheet PDF文件第2页浏览型号IDT71V3576S200BG8的Datasheet PDF文件第3页浏览型号IDT71V3576S200BG8的Datasheet PDF文件第4页浏览型号IDT71V3576S200BG8的Datasheet PDF文件第5页浏览型号IDT71V3576S200BG8的Datasheet PDF文件第6页浏览型号IDT71V3576S200BG8的Datasheet PDF文件第7页 
128K X 36, 256K X 18  
Preliminary  
IDT71V3576  
IDT71V3578  
3.3V Synchronous SRAMs  
3.3V I/O, Pipelined Outputs  
Burst Counter, Single Cycle Deselect  
Features  
Description  
128K x 36, 256K x 18 memory configurations  
The IDT71V3576/78 are high-speed SRAMs organized as  
128Kx36/256Kx18. TheIDT71V3576/78SRAMscontainwrite, data,  
addressandcontrolregisters. InternallogicallowstheSRAMtogenerate  
aself-timedwritebaseduponadecisionwhichcanbeleftuntiltheendof  
thewritecycle.  
Supports high system speed:  
– 200MHz 3.1ns clock access time  
– 183MHz 3.3ns clock access time  
– 166MHz 3.5ns clock access time  
– 150MHz 3.8ns clock access time  
– 133MHz 4.2ns clock access time  
Theburstmodefeatureoffersthehighestlevelofperformancetothe  
systemdesigner,astheIDT71V3576/78canprovidefourcyclesofdata  
forasingleaddresspresentedtotheSRAM. Aninternalburstaddress  
LBO input selects interleaved or linear burst mode  
Self-timedwritecyclewithglobalwritecontrol(GW),bytewrite counteracceptsthefirstcycleaddressfromtheprocessor,initiatingthe  
enable (BWE), and byte writes (BWx)  
3.3V core power supply  
Power down controlled by ZZ input  
3.3V I/O  
accesssequence.Thefirstcycleofoutputdatawillbepipelinedforone  
cycle before it is available on the next rising clock edge. If burst mode  
operationisselected(ADV=LOW),thesubsequentthreecyclesofoutput  
datawillbeavailabletotheuseronthenextthreerisingclockedges. The  
Packaged in a JEDEC Standard 100-lead plastic thin quad orderofthesethreeaddressesaredefinedbytheinternalburstcounter  
flatpack (TQFP) and 119-lead ball grid array (BGA)  
and the LBOinput pin.  
The IDT71V3576/78 SRAMs utilize IDT’s latest high-performance  
CMOSprocessandarepackagedinaJEDECstandard14mmx20mm  
100-leadthinplasticquadflatpack(TQFP)aswellasa119-leadballgrid  
array (BGA).  
PinDescriptionSummary  
0
17  
A -A  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
I/O  
Synchronous  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enable  
CE  
0
1
CS , CS  
Chip Selects  
Output Enable  
OE  
Global Write Enable  
Byte Write Enable  
Individual Byte Write Selects  
Clock  
GW  
BWE  
(1)  
1,  
2,  
3,  
4
BW BW BW BW  
CLK  
ADV  
ADSC  
ADSP  
LBO  
ZZ  
Burst Address Advance  
Address Status (Cache Controller)  
Address Status (Processor)  
Linear / Interleaved Burst Order  
Sleep Mode  
Synchronous  
Synchronous  
Synchronous  
DC  
Asynchronous  
Synchronous  
N/A  
0
31  
P1  
P4  
I/O -I/O , I/O -I/O  
Data Input / Output  
Core Power, I/O Power  
Ground  
DD DDQ  
V
V
, V  
Supply  
Supply  
SS  
N/A  
5279 tbl 01  
NOTE:  
1. BW3 and BW4 are not applicable for the IDT71V3578.  
SEPTEMBER1999  
1
©1999IntegratedDeviceTechnology,Inc.  
DSC-5279/3  

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