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IBM0418A41NLAB-3 PDF预览

IBM0418A41NLAB-3

更新时间: 2023-01-03 08:22:09
品牌 Logo 应用领域
国际商业机器公司 - IBM 静态存储器
页数 文件大小 规格书
25页 477K
描述
Standard SRAM, 256KX18, 1.8ns, CMOS, PBGA119, BGA-119

IBM0418A41NLAB-3 技术参数

生命周期:Contact Manufacturer零件包装代码:BGA
包装说明:BGA, BGA119,7X17,50针数:119
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.51
最长访问时间:2 ns其他特性:LATE WRITE
I/O 类型:COMMONJESD-30 代码:R-PBGA-B119
长度:22 mm内存密度:4718592 bit
内存集成电路类型:STANDARD SRAM内存宽度:18
功能数量:1端子数量:119
字数:262144 words字数代码:256000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:组织:256KX18
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA119,7X17,50
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL电源:2.5,3.3 V
认证状态:Not Qualified座面最大高度:2.679 mm
最大待机电流:0.1 A最小待机电流:3.14 V
子类别:SRAMs最大压摆率:0.415 mA
最大供电电压 (Vsup):3.63 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM宽度:14 mm
Base Number Matches:1

IBM0418A41NLAB-3 数据手册

 浏览型号IBM0418A41NLAB-3的Datasheet PDF文件第3页浏览型号IBM0418A41NLAB-3的Datasheet PDF文件第4页浏览型号IBM0418A41NLAB-3的Datasheet PDF文件第5页浏览型号IBM0418A41NLAB-3的Datasheet PDF文件第7页浏览型号IBM0418A41NLAB-3的Datasheet PDF文件第8页浏览型号IBM0418A41NLAB-3的Datasheet PDF文件第9页 
IBM0436A41NLAB IBM0418A41NLAB  
IBM0418A81NLAB IBM0436A81NLAB  
8Mb (256Kx36 & 512Kx18) and 4Mb (128Kx36 & 256Kx18) SRAM  
SRAM Features  
Late Write  
The late write function allows for write data to be registered one cycle after addresses and controls. This fea-  
ture eliminates one bus-turnaround cycle, necessary when going from a read to a write operation. Late write  
is accomplished by buffering write addresses and data so that the write operation occurs during the next write  
cycle. When a read cycle occurs after a write cycle, the address and write data information are stored tempo-  
rarily in holding registers. During the first write cycle preceded by a read cycle, the SRAM array will be  
updated with address and data from the holding registers. Read cycle addresses are monitored to determine  
if read data is to be supplied from the SRAM array or the write buffer. The bypassing of the SRAM array  
occurs on a byte-by-byte basis. When only one byte is written during a write cycle, read data from the last  
written address will have new byte data from the write buffer and remaining bytes from the SRAM array.  
Mode Control  
Mode control pins M1 and M2 are used to select four different JEDEC-standard read protocols. This SRAM  
supports a single clock pipeline (M1 = V , M2 = V ). This datasheet only describes single-clock pipeline  
SS  
DD  
functionality. Mode control inputs must be set on power up and must not change during SRAM operation.  
This SRAM is tested only in the pipeline mode.  
Sleep Mode  
Sleep mode is enabled by switching synchronous signal ZZ high. When the SRAM is in sleep mode, the out-  
puts will go to a High-Z state and the SRAM will draw standby current. SRAM data will be preserved and a  
recovery time (t  
) is required before the SRAM resumes normal operation.  
ZZR  
Power-Up Requirements  
In order to guarantee the optimum internally regulated supply voltage, the SRAM requires 4µs of power-up  
time after V reaches its operating range.  
DD  
Power-Up and Power-Down Sequencing  
The power supplies need to be powered up in the following order: V , V  
, and inputs. The power-down  
DDQ  
DD  
sequencing must be in the reverse order. V  
can be allowed to exceed V by no more than 0.6V.  
DDQ  
DD  
crrL3325.06.fm  
June 13, 2002  
Page 6 of 25  

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