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I1790SY01 PDF预览

I1790SY01

更新时间: 2024-02-11 09:43:03
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 180s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28

I1790SY01 技术参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP,针数:28
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84商用集成电路类型:SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码:R-PDSO-G28JESD-609代码:e3
长度:17.93 mm功能数量:1
端子数量:28片上内存类型:FLASH
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
认证状态:Not Qualified最长读取时间:180 s
座面最大高度:2.64 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.4 V表面贴装:YES
温度等级:COMMERCIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL宽度:7.52 mm
Base Number Matches:1

I1790SY01 数据手册

 浏览型号I1790SY01的Datasheet PDF文件第18页浏览型号I1790SY01的Datasheet PDF文件第19页浏览型号I1790SY01的Datasheet PDF文件第20页浏览型号I1790SY01的Datasheet PDF文件第22页浏览型号I1790SY01的Datasheet PDF文件第23页浏览型号I1790SY01的Datasheet PDF文件第24页 
ISD1700 SERIES  
11.3 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP)  
Plastic Dual Inline Package (PDIP) (P) Dimensions  
INCHES  
MILLIMETERS  
Min  
1.445  
Nom  
1.450  
0.150  
0.070  
Max  
1.455  
Min  
36.70  
Nom  
36.83  
3.81  
Max  
36.96  
A
B1  
B2  
C1  
C2  
D
0.065  
0.600  
0.530  
0.075  
0.625  
0.550  
0.19  
1.65  
15.24  
13.46  
1.78  
1.91  
15.88  
13.97  
4.83  
0.540  
13.72  
D1  
E
F
G
H
J
S
0
0.015  
0.125  
0.015  
0.055  
0.38  
3.18  
0.38  
1.40  
0.135  
0.022  
0.065  
3.43  
0.56  
1.65  
0.018  
0.060  
0.100  
0.010  
0.075  
0.46  
1.52  
2.54  
0.25  
1.91  
0.008  
0.070  
0°  
0.012  
0.080  
15°  
0.20  
1.78  
0°  
0.30  
2.03  
15°  
11.4 DIE INFORMATION  
For die info, please contact the local Winbond Sales Representatives.  
Publication Release Date: January 23, 2007  
Revision 1.3-S2  
- 21 -  

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