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I1806P PDF预览

I1806P

更新时间: 2024-11-08 22:33:51
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
26页 646K
描述
SINGLE-CHIP, SINGLE-MESSAGE VOICE RECORD/PLAYBACK DEVICE 6- TO 16-SECOND DURATION

I1806P 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP,
针数:28Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.92
商用集成电路类型:SPEECH SYNTHESIZER WITH RCDGJESD-30 代码:R-PDIP-T28
JESD-609代码:e0长度:36.83 mm
功能数量:1端子数量:28
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
最长读取时间:720 s座面最大高度:4.83 mm
最大供电电压 (Vsup):4.5 V最小供电电压 (Vsup):2.7 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子面层:TIN LEAD
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15.24 mmBase Number Matches:1

I1806P 数据手册

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PRELIMINARY  
I1800 SERIES  
SINGLE-CHIP, SINGLE-MESSAGE  
VOICE RECORD/PLAYBACK DEVICE  
6- TO 16-SECOND DURATION  
Publication Release Date: May 2003  
Revision 0.0  
- 1 -  

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