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I17150XYI01 PDF预览

I17150XYI01

更新时间: 2024-09-17 18:59:39
品牌 Logo 应用领域
华邦 - WINBOND 商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 300s, DIE

I17150XYI01 技术参数

生命周期:Obsolete零件包装代码:DIE
包装说明:DIE,Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.83
Is Samacsys:N商用集成电路类型:SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码:X-XUUC-N功能数量:1
片上内存类型:FLASH最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:UNSPECIFIED
封装形式:UNCASED CHIP认证状态:Not Qualified
最长读取时间:300 s最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.4 V表面贴装:YES
温度等级:INDUSTRIAL端子形式:NO LEAD
端子位置:UPPERBase Number Matches:1

I17150XYI01 数据手册

 浏览型号I17150XYI01的Datasheet PDF文件第2页浏览型号I17150XYI01的Datasheet PDF文件第3页浏览型号I17150XYI01的Datasheet PDF文件第4页浏览型号I17150XYI01的Datasheet PDF文件第5页浏览型号I17150XYI01的Datasheet PDF文件第6页浏览型号I17150XYI01的Datasheet PDF文件第7页 
PRELIMINARY  
ISD1700  
Series  
Multi-Message  
Single-Chip  
Voice Record & Playback Devices  
Publication Release Date: January 23, 2007  
Revision 1.3-S2  

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