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I17180EY PDF预览

I17180EY

更新时间: 2024-02-22 03:01:32
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 360s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28

I17180EY 技术参数

生命周期:Obsolete零件包装代码:TSOP
包装说明:TSOP1,针数:28
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84商用集成电路类型:SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码:R-PDSO-G28JESD-609代码:e3
长度:11.8 mm功能数量:1
端子数量:28片上内存类型:FLASH
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
认证状态:Not Qualified最长读取时间:360 s
座面最大高度:1.2 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.4 V表面贴装:YES
温度等级:COMMERCIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.55 mm
端子位置:DUAL宽度:8 mm
Base Number Matches:1

I17180EY 数据手册

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PRELIMINARY  
ISD1700  
Series  
Multi-Message  
Single-Chip  
Voice Record & Playback Devices  
Publication Release Date: January 23, 2007  
Revision 1.3-S2  

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