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HYR164830G-840 PDF预览

HYR164830G-840

更新时间: 2024-11-11 19:42:27
品牌 Logo 应用领域
英飞凌 - INFINEON 动态存储器内存集成电路
页数 文件大小 规格书
14页 434K
描述
Rambus DRAM Module, 48MX16, CMOS, RIMM-184

HYR164830G-840 技术参数

生命周期:Obsolete零件包装代码:DMA
包装说明:,针数:84
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.32风险等级:5.84
访问模式:BLOCK ORIENTED PROTOCOLJESD-30 代码:R-XDMA-N184
内存密度:805306368 bit内存集成电路类型:RAMBUS DRAM MODULE
内存宽度:16功能数量:1
端口数量:1端子数量:84
字数:50331648 words字数代码:48000000
工作模式:SYNCHRONOUS组织:48MX16
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY认证状态:Not Qualified
最大供电电压 (Vsup):2.63 V最小供电电压 (Vsup):2.37 V
标称供电电压 (Vsup):2.5 V表面贴装:NO
技术:CMOS端子形式:NO LEAD
端子位置:DUALBase Number Matches:1

HYR164830G-840 数据手册

 浏览型号HYR164830G-840的Datasheet PDF文件第2页浏览型号HYR164830G-840的Datasheet PDF文件第3页浏览型号HYR164830G-840的Datasheet PDF文件第4页浏览型号HYR164830G-840的Datasheet PDF文件第5页浏览型号HYR164830G-840的Datasheet PDF文件第6页浏览型号HYR164830G-840的Datasheet PDF文件第7页 
HYR16xx30/HYR18xx20G  
Rambus RIMM Modules  
(with 128/144 Mb RDRAMs)  
Direct RDRAM RIMM Modules  
Perliminary Information  
Rev. 0.9  
Overview  
Form Factor  
The Direct Rambus™ RIMM™ module is a general  
purpose high-performance memory subsystem suitable  
for use in a broad range of applications including  
computer memory, personal computers, workstations,  
and other applications where high bandwidth and low  
latency are required.  
The Rambus RIMM modules are offered in a 184-pad  
1mm edge connector pad pitch form factor suitable for  
either 184 or 168 contact RIMM connectors. The RIMM  
module is suitable for desktop and other system appli-  
cations. Figure 1 shows an eight device Rambus RIMM  
module without heat spreader.  
The 128 MB Direct Rambus RIMM module consists of  
eight 128Mb/ 144Mb Direct Rambus DRAM (Direct  
RDRAM™) devices. These are extremely high-speed  
CMOS DRAMs organized as 8M words by 16 or 18  
bits. The use of Rambus Signaling Level (RSL) tech-  
nology permits 600MHz to 800MHz transfer rates while  
using conventional system and board design technolo-  
gies. Direct RDRAM devices are capable of sustained  
data transfers at 1.25 ns per two bytes (10ns per  
sixteen bytes).  
Features  
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High speed 800, 711 & 600 MHz RDRAM storage  
184 edge connector pads with 1mm pad spacing  
Maximum module PCB size: 133.5mm x 34.9mm x  
1.37mm (5.21” x 1.36” x 0.05”)  
n
Each RDRAM has 32 banks, for a total of  
256banks on each 128MB module  
The RDRAM architecture enables the highest  
sustained bandwidth for multiple, simultaneous,  
randomly addressed, memory transactions. The sepa-  
rate control and data buses with independent row and  
column control yield over 95% bus efficiency. The  
RDRAM's 32-bank architecture supports up to four  
simultaneous transactions per device.  
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Gold plated edge connector pad contacts  
Serial Presence Detect (SPD) support  
Operates from a 2.5 volt supply (±5%)  
Low power and powerdown self refresh modes  
Separate Row and Column buses for higher effi-  
ciency  
Last Modified on 7/13/99  
1

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