16Mx64 bits
Unbuffered DDR SO-DIMM
HYMD216M646(L)6-K/H/L
DESCRIPTION
Hynix HYMD216M646(L)6-K/H/L series is unbuffered 200-pin double data rate Synchronous DRAM Small Outline Dual
In-Line Memory Modules (SO-DIMMs) which are organized as 16Mx64 high-speed memoryarrays. Hynix
HYMD216M646(L)6-K/H/L series consists of four 16Mx16 DDR SDRAM in 400mil TSOP II packages on a 200pin glass-
epoxy substrate. Hynix HYMD216M646(L)6-K/H/L series provide a high performance 8-byte interface in 67.60mmX
31.75mm form factor of industry standard. It is suitable for easy interchange and addition.
Hynix HYMD216M646(L)6-K/H/L series is designed for high speed of up to 133MHz and offers fully synchronous oper-
ations referenced to both rising and falling edges of differential clock inputs. While all addresses and control inputs are
latched on the rising edges of the clock, Data, Data strobes and Write data masks inputs are sampled on both rising
and falling edges of it. The data paths are internally pipelined and 2-bit prefetched to achieve very high bandwidth. All
input and output voltage levels are compatible with SSTL_2. High speed frequencies, programmable latencies and
burst lengths allow variety of device operation in high performance memory system.
Hynix HYMD216M646(L)6-K/H/L series incorporates SPD(serial presence detect). Serial presence detect function is
implemented via a serial 2,048-bit EEPROM. The first 128 bytes of serial PD data are programmed by Hynix to identify
DIMM type, capacity and other the information of DIMM and the last 128 bytes are available to the customer.
FEATURES
•
128MB (16M x 64) Unbuffered DDR SO-DIMM based
on 16Mx16 DDR SDRAM
•
•
Data inputs on DQS centers when write (centered
DQ)
•
JEDEC Standard 200-pin small outline dual in-line
memory module (SO-DIMM)
Data strobes synchronized with output data for read
and input data for write
•
•
2.5V +/- 0.2V VDD and VDDQ Power supply
•
•
Programmable CAS Latency 2 / 2.5 supported
All inputs and outputs are compatible with SSTL_2
interface
Programmable Burst Length 2 / 4 / 8 with both
sequential and interleave mode
•
•
Fully differential clock operations (CK & /CK) with
100MHz/125MHz/133MHz
•
•
•
•
tRAS Lock-out function supported
Internal four bank operations with single pulsed RAS
Auto refresh and self refresh supported
8192 refresh cycles / 64ms
All addresses and control inputs except Data, Data
strobes and Data masks latched on the rising edges
of the clock
•
Data(DQ), Data strobes and Write masks latched on
both rising and falling edges of the clock
ORDERING INFORMATION
Part No.
Power Supply
Clock Frequency
Interface
Form Factor
HYMD216M646(L)6-K
HYMD216M646(L)6-H
HYMD216M646(L)6-L
133MHz(*DDR266A)
133MHz(*DDR266B)
100MHz(*DDR200)
VDD=2.5V
VDDQ=2.5V
200pin Unbuffered SO-DIMM
67.6mm x 31.75mm x 3.8mm
SSTL_2
* JEDEC Defined Specifications compliant
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 0.5/May. 02
1