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HYMD216M646D6-H PDF预览

HYMD216M646D6-H

更新时间: 2024-11-11 05:38:47
品牌 Logo 应用领域
海力士 - HYNIX 动态存储器双倍数据速率
页数 文件大小 规格书
23页 260K
描述
200pin Unbuffered DDR SDRAM SO-DIMMs based on 256Mb D ver. (TSOP)

HYMD216M646D6-H 数据手册

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200pin Unbuffered DDR SDRAM SO-DIMMs based on 256Mb D ver. (TSOP)  
This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR  
SDRAMs in 400 mil TSOP II packages on a 200pin glass-epoxy substrate. This Hynix 256Mb D ver. based unbuffered  
SO-DIMM series provide a high performance 8 byte interface in 67.60mm width form factor of industry standard. It is  
suitable for easy interchange and addition.  
FEATURES  
JEDEC Standard 200-pin small outline, dual in-line  
memory module (SO-DIMM)  
Programmable Burst Length 2 / 4 / 8 with both  
sequential and interleave mode  
Two ranks 32M x 64 and One rank 32M x 64, 16M x  
64 organization  
Edge-aligned DQS with data outs and Center-aligned  
DQS with data inputs  
Auto refresh and self refresh supported  
8192 refresh cycles / 64ms  
2.6V ± 0.1V VDD and VDDQ Power supply for  
DDR400, 2.5V ± 0.2V for DDR333 and below  
All inputs and outputs are compatible with SSTL_2  
interface  
Serial Presence Detect (SPD) with EEPROM  
Built with 256Mb DDR SDRAMs in 400 mil TSOP II  
packages  
Fully differential clock operations (CK & /CK) with  
133/166/200MHz  
Lead-free product listed for each configuration  
(RoHS compliant)  
DLL aligns DQ and DQS transition with CK transition  
Programmable CAS Latency: DDR266(2, 2.5 clock),  
DDR333(2.5 clock), DDR400(3 clock)  
ADDRESS TABLE  
# of  
DRAMs  
Refresh  
# of row/bank/column Address  
Method  
Organization  
Ranks  
SDRAMs  
256MB  
256MB  
128MB  
32M x 64  
32M x 64  
16M x 64  
2
1
1
16Mb x 16  
32Mb x 8  
16Mb x 16  
8
8
4
13(A0~A12)/2(BA0,BA1)/9(A0~A8)  
13(A0~A12)/2(BA0,BA1)/10(A0~A9)  
13(A0~A12)/2(BA0,BA1)/9(A0~A8)  
8K / 64ms  
8K / 64ms  
8K / 64ms  
PERFORMANCE RANGE  
-D431  
DDR400B  
3-3-3  
200  
Part-Number Suffix  
Speed Bin  
-J  
DDR333  
2.5-3-3  
-
-K  
DDR266A  
2-3-3  
-
-H  
DDR266B  
2.5-3-3  
-
Unit  
-
CL - tRCD- tRP  
CL=3  
CK  
MHz  
MHz  
MHz  
Max Clock  
Frequency  
CL=2.5  
166  
166  
133  
133  
CL=2  
133  
133  
133  
133  
Note:  
1. 2.6V +/- 0.1V VDD and VDDQ Power supply for DDR400 and 2.5V +/- 0.2V for DDR333 and below  
Rev. 1.1 / May. 2005  
1
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  

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