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HYMD216M646CL6-J PDF预览

HYMD216M646CL6-J

更新时间: 2024-11-11 05:37:15
品牌 Logo 应用领域
海力士 - HYNIX 双倍数据速率
页数 文件大小 规格书
19页 322K
描述
Unbuffered DDR SO-DIMM

HYMD216M646CL6-J 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:MODULE包装说明:DIMM, DIMM200,24
针数:200Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.32
风险等级:5.73访问模式:SINGLE BANK PAGE BURST
最长访问时间:0.7 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):166 MHzI/O 类型:COMMON
JESD-30 代码:R-XDMA-N200内存密度:1073741824 bit
内存集成电路类型:DDR DRAM MODULE内存宽度:64
功能数量:1端口数量:1
端子数量:200字数:16777216 words
字数代码:16000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:16MX64输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:DIMM
封装等效代码:DIMM200,24封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5 V认证状态:Not Qualified
刷新周期:8192自我刷新:YES
子类别:DRAMs最大压摆率:1.34 mA
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子形式:NO LEAD端子节距:0.6 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

HYMD216M646CL6-J 数据手册

 浏览型号HYMD216M646CL6-J的Datasheet PDF文件第2页浏览型号HYMD216M646CL6-J的Datasheet PDF文件第3页浏览型号HYMD216M646CL6-J的Datasheet PDF文件第4页浏览型号HYMD216M646CL6-J的Datasheet PDF文件第5页浏览型号HYMD216M646CL6-J的Datasheet PDF文件第6页浏览型号HYMD216M646CL6-J的Datasheet PDF文件第7页 
16Mx64 bits  
Unbuffered DDR SO-DIMM  
HYMD216M646C(L)6-D43/D4/J  
Document Title  
16M x 64 bits Unbuffered DDR SO-DIMM  
Revision History  
No.  
History  
Draft Date Remark  
0.1  
Defined Preliminary Specification  
Apr. 2003  
1) Reflected a "notational" change in module thickness on page 16 - Not Real ! -  
2) Corrected some typos  
0.2  
Apr. 2004  
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  
Rev. 0.1 / Apr. 2003  
1

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