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HY57W283220T-8 PDF预览

HY57W283220T-8

更新时间: 2024-11-24 19:51:59
品牌 Logo 应用领域
海力士 - HYNIX 时钟动态存储器光电二极管内存集成电路
页数 文件大小 规格书
25页 399K
描述
Synchronous DRAM, 4MX32, 6ns, CMOS, PDSO86,

HY57W283220T-8 技术参数

生命周期:Active包装说明:TSSOP, TSSOP86,.46,20
Reach Compliance Code:compliant风险等级:5.75
最长访问时间:6 ns最大时钟频率 (fCLK):125 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:R-PDSO-G86内存密度:134217728 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:32
端子数量:86字数:4194304 words
字数代码:4000000最高工作温度:85 °C
最低工作温度:-25 °C组织:4MX32
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP86,.46,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
电源:1.8/2.5,2.5 V认证状态:Not Qualified
刷新周期:4096连续突发长度:1,2,4,8,FP
最大待机电流:0.0006 A子类别:DRAMs
最大压摆率:0.15 mA表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUALBase Number Matches:1

HY57W283220T-8 数据手册

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HY5W2A2(L/S)F / HY57W2A3220(L/S)T  
HY5W22F / HY57W283220T  
4Banks x 1M x 32bits Synchronous DRAM  
DESCRIPTION  
The Hynix Low Power SDRAM is suited for non-PC application which use the batteries such as PDAs, 2.5G and 3G  
cellular phones with internet access and multimedia capabilities, mini-notebook, handheld PCs  
The Hynix HY5W2A2F series is a 134,217,728-bit CMOS Synchronous DRAM, ideally suited for the memory applica-  
tions which require wide data I/O and high bandwidth. HY5W2A2F series is organized as 4banks of 1,048,576x32.  
The Low Power SDRAM provides for programmable options including CAS latency of 1, 2, or 3, READ or WRITE burst  
length of 1, 2, 4, 8, or full page, and the burst count sequence(sequential or interleave). And the Low Power SDRAM  
also provides for special programmable options including Partial Array Self Refresh of 1bank, 2banks, or all banks,  
Temperature Compensated Self Refresh of 15, 45, 70, or 85 degrees C. A burst of Read or Write cycles in progress  
can be terminated by a burst terminate command or can be interrupted and replaced by a new burst Read or Write  
command on any cycle(This pipelined design is not restricted by a 2N rule).  
Deep Power Down Mode is a additional operating mode for Low Power SDRAM. This mode can achieve maximum  
power reduction by removing power to the memory array within each SDRAM. By using this feature, the system can  
cut off alomost all DRAM power without adding the cost of a power switch and giving up mother-board power-line lay-  
out flexibility.  
FEATURES  
Standard SDRAM Protocol  
Internal 4bank operation  
Voltage : VDD = 2.5V, VDDQ = 1.8V & 2.5V  
LVTTL compatible I/O Interface  
Low Voltage interface to reduce I/O power  
Low Power Features ( HY5W22F / HY57W283220T series can’t support these features)  
- PASR(Partial Array Self Refresh)  
- TCSR(Temperature Compensated Self Refresh)  
- Deep Power Down Mode  
Packages : 90ball, 0.8mm pitch FBGA / 86pin, TSOP  
-25 ~ 85C Operation  
ORDERING INFORMATION  
Clock Frequency  
Part No.  
Organization  
Interface  
Package  
CAS Latench  
HY57W2A3220(L/S)T-H  
HY5W2A2(L/S)F-H  
133MHz  
CL 3  
4Banks x 1Mbits  
x32  
LVTTL  
LVTTL  
LVTTL  
LVTTL  
LVTTL  
HY57W2A3220(L/S)T-8  
HY5W2A2(L/S)F-8  
125MHz  
CL 3  
4Banks x 1Mbits  
x32  
90balls FBGA  
(HY5xxxxxxF)  
86pin TSOP-II  
(HY5xxxxxxT)  
HY57W2A3220(L/S)T-P  
HY5W2A2(L/S)F-P  
100MHz  
CL 2  
4Banks x 1Mbits  
x32  
HY57W2A3220(L/S)T-S  
HY5W2A2(L/S)F-S  
100MHz  
CL 3  
4Banks x 1Mbits  
x32  
HY57W2A3220(L/S)T-B  
HY5W2A2(L/S)F-B  
66MHz  
CL 2  
4Banks x 1Mbits  
x32  
This document is a general product description and is subject to change without notice. Hynix Semiconductor Inc. does not assume  
any responsibility for use of circuits described. No patent licenses are implied.  
Rev. 0.5/Jan. 03  

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