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HY57V641620HGT-H PDF预览

HY57V641620HGT-H

更新时间: 2024-11-26 22:23:27
品牌 Logo 应用领域
海力士 - HYNIX 动态存储器
页数 文件大小 规格书
12页 88K
描述
4 Banks x 1M x 16Bit Synchronous DRAM

HY57V641620HGT-H 技术参数

生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2, TSOP54,.46,32针数:54
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.76
访问模式:FOUR BANK PAGE BURST最长访问时间:5.4 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:R-PDSO-G54JESD-609代码:e6
长度:22.23 mm内存密度:67108864 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:54字数:4194304 words
字数代码:4000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:4MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP54,.46,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE电源:3.3 V
认证状态:Not Qualified刷新周期:4096
座面最大高度:1.194 mm自我刷新:YES
连续突发长度:1,2,4,8,FP最大待机电流:0.002 A
子类别:DRAMs最大压摆率:0.16 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN BISMUTH端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
宽度:10.16 mmBase Number Matches:1

HY57V641620HGT-H 数据手册

 浏览型号HY57V641620HGT-H的Datasheet PDF文件第2页浏览型号HY57V641620HGT-H的Datasheet PDF文件第3页浏览型号HY57V641620HGT-H的Datasheet PDF文件第4页浏览型号HY57V641620HGT-H的Datasheet PDF文件第5页浏览型号HY57V641620HGT-H的Datasheet PDF文件第6页浏览型号HY57V641620HGT-H的Datasheet PDF文件第7页 
HY57V641620HG  
4 Banks x 1M x 16Bit Synchronous DRAM  
DESCRIPTION  
The Hynix HY57V641620HG is a 67,108,864-bit CMOS Synchronous DRAM, ideally suited for the main memory applications which  
require large memory density and high bandwidth. HY57V641620HG is organized as 4banks of 1,048,576x16.  
HY57V641620HG is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are synchro-  
nized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and output  
voltage levels are compatible with LVTTL.  
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write cycles initiated  
by a single control command (Burst length of 1,2,4,8 or Full page), and the burst count sequence(sequential or interleave). A burst of  
read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst  
read or write command on any cycle. (This pipelined design is not restricted by a `2N` rule.)  
FEATURES  
Auto refresh and self refresh  
Single 3.3±0 . 3 V p o w e r s u p p l y N o t e )  
4096 refresh cycles / 64ms  
All device pins are compatible with LVTTL interface  
Programmable Burst Length and Burst Type  
- 1, 2, 4, 8 or Full page for Sequential Burst  
- 1, 2, 4 or 8 for Interleave Burst  
J E D E C s t a n d a r d 4 0 0 m i l 5 4 p i n T S O P - I I w i t h 0 . 8 m m  
of pin pitch  
All inputs and outputs referenced to positive edge of  
system clock  
P r o g r a m m a b l e C A S Latency ; 2, 3 Clocks  
D a t a m a s k f u n c t i o n b y U D Q M o r L D Q M  
Internal four banks operation  
OR D E R IN G INF ORMAT ION  
Par t No.  
C l ock Fr equency  
Po we r  
Or gani zat i on  
I nt erf ace  
Package  
H Y 5 7 V 6 4 1 6 2 0 H G T - 5 / 5 5 / 6 / 7  
H Y 5 7 V 6 4 1 6 2 0 H G T - K  
H Y 5 7 V 6 4 1 6 2 0 H G T - H  
H Y 5 7 V 6 4 1 6 2 0 H G T - 8  
2 0 0 / 1 8 3 / 1 6 6 / 1 4 3 M H z  
1 3 3 M H z  
1 3 3 M H z  
N o r m a l  
1 2 5 M H z  
H Y 5 7 V 6 4 1 6 2 0 H G T - P  
H Y 5 7 V 6 4 1 6 2 0 H G T - S  
H Y 5 7 V 6 4 1 6 2 0 H G L T - 5 / 5 5 / 6 / 7  
H Y 5 7 V 6 4 1 6 2 0 H G L T - K  
H Y 5 7 V 6 4 1 6 2 0 H G L T - H  
H Y 5 7 V 6 4 1 6 2 0 H G L T - 8  
H Y 5 7 V 6 4 1 6 2 0 H G L T - P  
H Y 5 7 V 6 4 1 6 2 0 H G L T - S  
1 0 0 M H z  
1 0 0 M H z  
4 B a n k s x 1 M b i t s  
x 1 6  
L V T T L  
400mil 54pin TSOP II  
2 0 0 / 1 8 3 / 1 6 6 / 1 4 3 M H z  
1 3 3 M H z  
1 3 3 M H z  
L o w p o w e r  
1 2 5 M H z  
1 0 0 M H z  
1 0 0 M H z  
Not e : VDD( M in) of HY5 7 V6 4 1 6 2 0 HG( L) T- 5 /55/ 6 i s 3. 135V  
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any responsibility for use of  
circuits described. No patent licenses are implied.  
Rev. 0. 5/ Jun. 01  

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