5秒后页面跳转
HY27US08281A-TPIB PDF预览

HY27US08281A-TPIB

更新时间: 2024-11-23 19:20:47
品牌 Logo 应用领域
海力士 - HYNIX ISM频段光电二极管内存集成电路
页数 文件大小 规格书
44页 344K
描述
Flash, 16MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48

HY27US08281A-TPIB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSOP1
包装说明:12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48针数:48
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.81
最长访问时间:30 ns命令用户界面:YES
数据轮询:NOJESD-30 代码:R-PDSO-G48
JESD-609代码:e6长度:18.4 mm
内存密度:134217728 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
部门数/规模:1K端子数量:48
字数:16777216 words字数代码:16000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:16MX8
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE页面大小:512 words
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:3.3 V编程电压:3.3 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.2 mm部门规模:16K
最大待机电流:0.00005 A子类别:Flash Memories
最大压摆率:0.02 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN BISMUTH
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:20
切换位:NO类型:NAND TYPE
宽度:12 mmBase Number Matches:1

HY27US08281A-TPIB 数据手册

 浏览型号HY27US08281A-TPIB的Datasheet PDF文件第2页浏览型号HY27US08281A-TPIB的Datasheet PDF文件第3页浏览型号HY27US08281A-TPIB的Datasheet PDF文件第4页浏览型号HY27US08281A-TPIB的Datasheet PDF文件第5页浏览型号HY27US08281A-TPIB的Datasheet PDF文件第6页浏览型号HY27US08281A-TPIB的Datasheet PDF文件第7页 
HY27US(08/16)281A Series  
128Mbit (16Mx8bit / 8Mx16bit) NAND Flash  
Document Title  
128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Memory  
Revision History  
Revision  
History  
No.  
Draft Date  
Remark  
0.0  
Sep. 2004  
Preliminary  
Initial Draft.  
1) Correct Summary description & page.7  
- The Cache feature is deleted in summary description.  
- Note.3 is deleted. (page.7)  
2) Correct table.5 & Table.12  
3) Correct TSOp1, WSOP1 Pin description  
- 38th pin has been changed Lockpre  
0.1  
Nov. 29. 2004  
Preliminary  
4) Add Bad Block Management & System Interface using CE don’t care  
5) Change TSOP1, WSOP1, FBGA package dimension & figures.  
- Change TSOP1, WSOP1, FBGA package mechanical data  
- Change TSOP1, WSOP1 package figures  
1) LOCKPRE is changed to PRE.  
- Texts, Tables and figures are changed.  
2) Change Command Set  
- READ A and B are changed to READ 1.  
- READ C is changed to READ 2.  
3) Change AC, DC characterics  
- tRB, tCRY, tCEH and tOH are added.  
4) Correct Program time (max)  
- before : 700us  
0.2  
Mar. 03. 2005  
Preliminary  
- after : 500us  
5) Edit figures  
- Address names are changed.  
6) Change AC characterics  
tRP  
30  
tREA  
35  
Before  
After  
25  
30  
Rev 0.6 / Nov. 2005  
1

与HY27US08281A-TPIB相关器件

型号 品牌 获取价格 描述 数据表
HY27US08281A-TPIP HYNIX

获取价格

Flash, 16MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48
HY27US08281A-TPIS HYNIX

获取价格

Flash, 16MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48
HY27US08282A HYNIX

获取价格

128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Memory
HY27US08561A HYNIX

获取价格

256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
HY27US08561A-FCB HYNIX

获取价格

Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, FBGA-63
HY27US08561A-FCS HYNIX

获取价格

Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, FBGA-63
HY27US08561A-FEP HYNIX

获取价格

Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, FBGA-63
HY27US08561A-FES HYNIX

获取价格

Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, FBGA-63
HY27US08561A-FMS HYNIX

获取价格

Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, FBGA-63
HY27US08561A-FPCP HYNIX

获取价格

Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, LEAD FREE, FBGA-63