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HY27US08561M PDF预览

HY27US08561M

更新时间: 2024-11-18 22:23:27
品牌 Logo 应用领域
海力士 - HYNIX 闪存
页数 文件大小 规格书
44页 733K
描述
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash

HY27US08561M 数据手册

 浏览型号HY27US08561M的Datasheet PDF文件第2页浏览型号HY27US08561M的Datasheet PDF文件第3页浏览型号HY27US08561M的Datasheet PDF文件第4页浏览型号HY27US08561M的Datasheet PDF文件第5页浏览型号HY27US08561M的Datasheet PDF文件第6页浏览型号HY27US08561M的Datasheet PDF文件第7页 
HY27SS(08/16)561M Series  
HY27US(08/16)561M Series  
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash  
Document Title  
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash Memory  
Revision History  
No.  
0.0  
0.1  
0.2  
History  
Draft Date  
Jul. 10. 2003  
Dec. 08. 2003  
Dec. 08. 2003  
Remark  
Preliminary  
Preliminary  
Preliminary  
Initial Draft  
Renewal Product Group  
Append 1.8V Operation Product to Data sheet  
Insert Spare Enable function for GND Pin(#6)  
- In case of Reading or Programming, GND Pin(#6) should be Low  
or High.  
0.3  
0.4  
- Change the test condition of Stand-by current-Refer to Table 13.  
Change CSP Package name & thickness  
- Name : VFBGA -> FBGA  
Mar. 08. 2004  
Jun. 01. 2004  
Preliminary  
Preliminary  
- Thickness : 1.0mm(max) -> 1.2mm(max)  
1) Delete Cache Program Mode  
2) Modify the description of Device Operations  
- /CE Don’t Care Enabled(Disabled) -> Sequential Row Read  
Disabled(Enabled) (Page23)  
1) change FBGA dimension  
0.5  
0.6  
0.7  
: Thickness : 1.2mm(max) -> 1.0mm(max)  
2) Edit Fig.33 read operation with CE don't care  
Sep. 24. 2004  
Oct. 18. 2004  
Oct. 20. 2004  
Preliminary  
Preliminary  
1) Change TSOP1,WSOP1,FBGA package dimension  
- Change TSOP1,WSOP1,FBGA mechanical data  
- Inches parameter has been excluded from the mechanical data table  
1) Change TSOP1, WSOP1, FBGA package dimension  
2) Edit TSOP1, WSOP1 package figures  
3) Change FBGA package figure  
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for  
use of circuits described. No patent licenses are implied.  
Rev 0.7 / Oct. 2004  
1

与HY27US08561M相关器件

型号 品牌 获取价格 描述 数据表
HY27US08561M-FCP HYNIX

获取价格

Flash, 32MX8, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-63
HY27US08561M-FEB HYNIX

获取价格

Flash, 32MX8, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-63
HY27US08561M-FES HYNIX

获取价格

Flash, 32MX8, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-63
HY27US08561M-FP HYNIX

获取价格

Flash, 32MX8, 35ns, PBGA63,
HY27US08561M-FPCB HYNIX

获取价格

Flash, 32MX8, 10000ns, PBGA63, 9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-6
HY27US08561M-FPCP HYNIX

获取价格

Flash, 32MX8, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-6
HY27US08561M-FPCS HYNIX

获取价格

Flash, 32MX8, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-6
HY27US08561M-FPEB HYNIX

获取价格

Flash, 32MX8, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-6
HY27US08561M-FPEP HYNIX

获取价格

Flash, 32MX8, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-6
HY27US08561M-FPES HYNIX

获取价格

Flash, 32MX8, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-6