是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-68 |
针数: | 68 | Reach Compliance Code: | unknown |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.92 | 最长访问时间: | 12000 ns |
JESD-30 代码: | R-PBGA-B68 | 长度: | 15 mm |
内存密度: | 536870912 bit | 内存集成电路类型: | FLASH |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 68 | 字数: | 33554432 words |
字数代码: | 32000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
组织: | 32MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 编程电压: | 1.8 V |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 1.95 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
类型: | NAND TYPE | 宽度: | 8.5 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
HY27SS16121M-FIS | HYNIX |
获取价格 |
暂无描述 | |
HY27SS16121M-FP | HYNIX |
获取价格 |
Flash, 32MX16, PBGA63 | |
HY27SS16121M-FPCB | HYNIX |
获取价格 |
Flash, 32MX16, 12000ns, PBGA63, 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB | |
HY27SS16121M-FPCP | HYNIX |
获取价格 |
Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB | |
HY27SS16121M-FPCS | HYNIX |
获取价格 |
Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB | |
HY27SS16121M-FPEB | HYNIX |
获取价格 |
暂无描述 | |
HY27SS16121M-FPEP | HYNIX |
获取价格 |
Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB | |
HY27SS16121M-FPES | HYNIX |
获取价格 |
Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB | |
HY27SS16121M-FPI | HYNIX |
获取价格 |
暂无描述 | |
HY27SS16121M-FPIB | HYNIX |
获取价格 |
Flash, 32MX16, 12000ns, PBGA63, 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB |