是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-68 |
针数: | 68 | Reach Compliance Code: | unknown |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.84 | 最长访问时间: | 12000 ns |
JESD-30 代码: | R-PBGA-B68 | JESD-609代码: | e1 |
长度: | 15 mm | 内存密度: | 536870912 bit |
内存集成电路类型: | FLASH | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 68 |
字数: | 33554432 words | 字数代码: | 32000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 32MX16 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
编程电压: | 1.8 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 1.95 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 20 |
类型: | NAND TYPE | 宽度: | 8.5 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
HY27SS16121M-FPEB | HYNIX |
获取价格 |
暂无描述 | |
HY27SS16121M-FPEP | HYNIX |
获取价格 |
Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB | |
HY27SS16121M-FPES | HYNIX |
获取价格 |
Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB | |
HY27SS16121M-FPI | HYNIX |
获取价格 |
暂无描述 | |
HY27SS16121M-FPIB | HYNIX |
获取价格 |
Flash, 32MX16, 12000ns, PBGA63, 8.50 X 15 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB | |
HY27SS16121M-FPIP | HYNIX |
获取价格 |
Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB | |
HY27SS16121M-FPIS | HYNIX |
获取价格 |
Flash, 32MX16, 12000ns, PBGA68, 15 X 8.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FB | |
HY27SS16561A | HYNIX |
获取价格 |
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash | |
HY27SS16561A-FCS | HYNIX |
获取价格 |
Flash, 16MX16, 35ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, FBGA-63 | |
HY27SS16561A-FEP | HYNIX |
获取价格 |
Flash, 16MX16, 35ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, FBGA-63 |